P

Inventor

SHIEH YUH CHERN

TW8 patents
⚠️ This page may combine multiple inventors who share the name “SHIEH YUH CHERN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

3 patents
US9406634B2Aug 2, 2016

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10157831B2Dec 18, 2018

Semiconductor device having a conductive via structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9514978B2Dec 6, 2016

Method of forming semiconductor device having a conductive via structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

SHIEH YUH CHERN

2 patents
US8288871B1Oct 16, 2012

Reduced-stress bump-on-trace (BOT) structures

SHIEH YUH CHERN53 citations95
US9041223B2May 26, 2015

Bump-on-trace (BOT) structures

SHIEH YUH CHERN0 citations50

CHEN YU-FENG

1 patent
US8970033B2Mar 3, 2015

Extending metal traces in bump-on-trace structures

CHEN YU-FENG7 citations82

LIN TSUNG-SHU

1 patent
US8519535B2Aug 27, 2013

Method and structure for controlling package warpage

LIN TSUNG-SHU1 citations49

CHANG KUO-CHIN

1 patent
US9159638B2Oct 13, 2015

Conductive via structure

CHANG KUO-CHIN0 citations44