Inventor

MYUNG JONG-YUN

KR4 patents

⚠️ This page may combine multiple inventors who share the name “MYUNG JONG-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US8922008B2Dec 30, 2014

Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure

SAMSUNG ELECTRONICS CO LTD5 citations71

US9159688B2Oct 13, 2015

Semiconductor device including a solder and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations59

MYUNG JONG-YUN

1 patent

US8563349B2Oct 22, 2013

Method of forming semiconductor device

MYUNG JONG-YUN2 citations55

LEE HYUEK-JAE

1 patent

US8304288B2Nov 6, 2012

Methods of packaging semiconductor devices including bridge patterns

LEE HYUEK-JAE0 citations46