Inventor

HONG JI-SUN

KR5 patents

⚠️ This page may combine multiple inventors who share the name “HONG JI-SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US8829686B2Sep 9, 2014

Package-on-package assembly including adhesive containment element

SAMSUNG ELECTRONICS CO LTD24 citations91

US7379113B2May 27, 2008

Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens

SAMSUNG ELECTRONICS CO LTD32 citations89

US10068878B2Sep 4, 2018

Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB

SAMSUNG ELECTRONICS CO LTD2 citations70

MYUNG JONG-YUN

1 patent

US8563349B2Oct 22, 2013

Method of forming semiconductor device

MYUNG JONG-YUN2 citations55

LEE HYUEK-JAE

1 patent

US8304288B2Nov 6, 2012

Methods of packaging semiconductor devices including bridge patterns

LEE HYUEK-JAE0 citations46