Inventor
HSU CHIA-LIN
TW62 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIA-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
21 patentsUS10049940B1Aug 14, 2018
Structure and method for metal gates with roughened barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD56 citations98
US10978350B2Apr 13, 2021
Structure and method for metal gates with roughened barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10497626B2Dec 3, 2019
Structure and method for metal gates with roughened barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9735050B2Aug 15, 2017
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11848554B2Dec 19, 2023
Electrostatic discharge circuit and method of operating same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276432B2Apr 30, 2019
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10079174B2Sep 18, 2018
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9589892B2Mar 7, 2017
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11557895B2Jan 17, 2023
Power clamp
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10644153B2May 5, 2020
Semiconductor device and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11855452B2Dec 26, 2023
Power clamp
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12538775B2Jan 27, 2026
Low-k dielectric damage prevention
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322959B2Jun 3, 2025
Electrostatic discharge circuit and method of operating same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699618B2Jul 11, 2023
Low-k dielectric damage prevention
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11171235B2Nov 9, 2021
Semiconductor device and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11726465B2Aug 15, 2023
Method for detecting environmental parameter in semiconductor fabrication facility
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US11493909B1Nov 8, 2022
Method for detecting environmental parameter in semiconductor fabrication facility
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations55
US12477835B2Nov 18, 2025
Integrated circuit protection device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504778B2Dec 10, 2019
Composite contact plug structure and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10263088B2Apr 16, 2019
Method for silicide formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859390B2Jan 2, 2018
Method for silicide formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
UNITED MICROELECTRONICS CORP
18 patentsUS6831013B2Dec 14, 2004
Method of forming a dual damascene via by using a metal hard mask layer
UNITED MICROELECTRONICS CORP36 citations93
US6638830B1Oct 28, 2003
Method for fabricating a high-density capacitor
UNITED MICROELECTRONICS CORP32 citations92
US6593185B1Jul 15, 2003
Method of forming embedded capacitor structure applied to logic integrated circuit
UNITED MICROELECTRONICS CORP45 citations92
US9147612B2Sep 29, 2015
Method for forming a semiconductor structure
UNITED MICROELECTRONICS CORP7 citations83
US7368042B2May 6, 2008
Electroplating apparatus including a real-time feedback system
UNITED MICROELECTRONICS CORP13 citations79
US9263282B2Feb 16, 2016
Method of fabricating semiconductor patterns
UNITED MICROELECTRONICS CORP5 citations73
US9159831B2Oct 13, 2015
Multigate field effect transistor and process thereof
UNITED MICROELECTRONICS CORP4 citations73
US6706140B2Mar 16, 2004
Control system for in-situ feeding back a polish profile
UNITED MICROELECTRONICS CORP9 citations73
US6660627B2Dec 9, 2003
Method for planarization of wafers with high selectivities
UNITED MICROELECTRONICS CORP9 citations73
US6455432B1Sep 24, 2002
Method for removing carbon-rich particles adhered on a copper surface
UNITED MICROELECTRONICS CORP8 citations73
US7718536B2May 18, 2010
Planarization process for pre-damascene structure including metal hard mask
UNITED MICROELECTRONICS CORP2 citations63
US7025661B2Apr 11, 2006
Chemical mechanical polishing process
UNITED MICROELECTRONICS CORP2 citations63
US6797190B2Sep 28, 2004
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
UNITED MICROELECTRONICS CORP5 citations62
US6709544B2Mar 23, 2004
Chemical mechanical polishing equipment
UNITED MICROELECTRONICS CORP4 citations62
US6638391B1Oct 28, 2003
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
UNITED MICROELECTRONICS CORP5 citations62
US6616510B2Sep 9, 2003
Chemical mechanical polishing method for copper
UNITED MICROELECTRONICS CORP3 citations62
US9012300B2Apr 21, 2015
Manufacturing method for a shallow trench isolation
UNITED MICROELECTRONICS CORP2 citations61
US9923095B2Mar 20, 2018
Manufacturing method of non-planar FET
UNITED MICROELECTRONICS CORP0 citations52
LIAO CHIN-I
3 patentsHSU CHUN-WEI
2 patentsCHIEN CHIN-CHENG
2 patentsTAIWAN SEMICONDUCTOR MFG
1 patentLIAO PO-JUI
1 patentHSU CHIA-LIN
1 patentTSAO WEI-CHE
1 patentShowing the top 50 of 62 patents by PatentIndex Score.