P

Inventor

HSU CHIA-LIN

TW62 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIA-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

21 patents
US10049940B1Aug 14, 2018

Structure and method for metal gates with roughened barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD56 citations98
US10978350B2Apr 13, 2021

Structure and method for metal gates with roughened barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10497626B2Dec 3, 2019

Structure and method for metal gates with roughened barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9735050B2Aug 15, 2017

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11848554B2Dec 19, 2023

Electrostatic discharge circuit and method of operating same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276432B2Apr 30, 2019

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10079174B2Sep 18, 2018

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9589892B2Mar 7, 2017

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11557895B2Jan 17, 2023

Power clamp

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10644153B2May 5, 2020

Semiconductor device and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11855452B2Dec 26, 2023

Power clamp

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12538775B2Jan 27, 2026

Low-k dielectric damage prevention

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322959B2Jun 3, 2025

Electrostatic discharge circuit and method of operating same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699618B2Jul 11, 2023

Low-k dielectric damage prevention

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11171235B2Nov 9, 2021

Semiconductor device and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11726465B2Aug 15, 2023

Method for detecting environmental parameter in semiconductor fabrication facility

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US11493909B1Nov 8, 2022

Method for detecting environmental parameter in semiconductor fabrication facility

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations55
US12477835B2Nov 18, 2025

Integrated circuit protection device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504778B2Dec 10, 2019

Composite contact plug structure and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10263088B2Apr 16, 2019

Method for silicide formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859390B2Jan 2, 2018

Method for silicide formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

UNITED MICROELECTRONICS CORP

18 patents
US6831013B2Dec 14, 2004

Method of forming a dual damascene via by using a metal hard mask layer

UNITED MICROELECTRONICS CORP36 citations93
US6638830B1Oct 28, 2003

Method for fabricating a high-density capacitor

UNITED MICROELECTRONICS CORP32 citations92
US6593185B1Jul 15, 2003

Method of forming embedded capacitor structure applied to logic integrated circuit

UNITED MICROELECTRONICS CORP45 citations92
US9147612B2Sep 29, 2015

Method for forming a semiconductor structure

UNITED MICROELECTRONICS CORP7 citations83
US7368042B2May 6, 2008

Electroplating apparatus including a real-time feedback system

UNITED MICROELECTRONICS CORP13 citations79
US9263282B2Feb 16, 2016

Method of fabricating semiconductor patterns

UNITED MICROELECTRONICS CORP5 citations73
US9159831B2Oct 13, 2015

Multigate field effect transistor and process thereof

UNITED MICROELECTRONICS CORP4 citations73
US6706140B2Mar 16, 2004

Control system for in-situ feeding back a polish profile

UNITED MICROELECTRONICS CORP9 citations73
US6660627B2Dec 9, 2003

Method for planarization of wafers with high selectivities

UNITED MICROELECTRONICS CORP9 citations73
US6455432B1Sep 24, 2002

Method for removing carbon-rich particles adhered on a copper surface

UNITED MICROELECTRONICS CORP8 citations73
US7718536B2May 18, 2010

Planarization process for pre-damascene structure including metal hard mask

UNITED MICROELECTRONICS CORP2 citations63
US7025661B2Apr 11, 2006

Chemical mechanical polishing process

UNITED MICROELECTRONICS CORP2 citations63
US6797190B2Sep 28, 2004

Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same

UNITED MICROELECTRONICS CORP5 citations62
US6709544B2Mar 23, 2004

Chemical mechanical polishing equipment

UNITED MICROELECTRONICS CORP4 citations62
US6638391B1Oct 28, 2003

Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same

UNITED MICROELECTRONICS CORP5 citations62
US6616510B2Sep 9, 2003

Chemical mechanical polishing method for copper

UNITED MICROELECTRONICS CORP3 citations62
US9012300B2Apr 21, 2015

Manufacturing method for a shallow trench isolation

UNITED MICROELECTRONICS CORP2 citations61
US9923095B2Mar 20, 2018

Manufacturing method of non-planar FET

UNITED MICROELECTRONICS CORP0 citations52

LIAO CHIN-I

3 patents

HSU CHUN-WEI

2 patents

CHIEN CHIN-CHENG

2 patents

TAIWAN SEMICONDUCTOR MFG

1 patent

LIAO PO-JUI

1 patent

HSU CHIA-LIN

1 patent

TSAO WEI-CHE

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.