Inventor

MAGNUS ALAN J

US24 patents

⚠️ This page may combine multiple inventors who share the name “MAGNUS ALAN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAGNUS ALAN J

FREESCALE SEMICONDUCTOR INC

Stacked semiconductor device assembly and method for forming

Wettable lead ends on a flat-pack no-lead microelectronic package

Semiconductor device package and method of manufacture

Shielding MEMS structures during wafer dicing

Methodology for processing a panel during semiconductor device fabrication

Localized redistribution layer structure for embedded component package and method

Semiconductor device package and method of manufacture

Method for shielding MEMS structures during front side wafer dicing

MAGNUS ALAN J

Redistributed chip packages containing multiple components and methods for the fabrication thereof

Electronic devices with embedded die interconnect structures, and methods of manufacture thereof

Semiconductor device package having backside contact and method for manufacturing

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof

NXP USA INC

Method for making an electronic component package

Method for increasing semiconductor device wafer strength

Using a backside mask layer for forming a unique die mark identifier pattern

Localized redistribution layer structure for embedded component package and method

YAP WENG F

Microelectronic packages having texturized solder pads and methods for the fabrication thereof

Optically-masked microelectronic packages and methods for the fabrication thereof

Wafer level packages having non-wettable solder collars and methods for the fabrication thereof

LIU LIANJUN

Electrical coupling of wafer structures

DANIELS DWIGHT L

Semiconductor device package and method of manufacture

VINCENT MICHAEL B

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

SEMICONDUCTOR COMPONENTS IND

Method of forming a contact

STERMER JR WILLIAM C

Microelectronic packages including patterned die attach material and methods for the fabrication thereof