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Inventor

WEI YAJUN

US24 patents
⚠️ This page may combine multiple inventors who share the name “WEI YAJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

L3 CINCINNATI ELECTRONICS CORP

9 patents
US10121922B2Nov 6, 2018

Tunneling barrier infrared detector devices

L3 CINCINNATI ELECTRONICS CORP1 citations61
US10886325B2Jan 5, 2021

Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same

L3 CINCINNATI ELECTRONICS CORP0 citations59
US11587971B2Feb 21, 2023

Infrared detector having a directly bonded silicon substrate present on top thereof

L3 CINCINNATI ELECTRONICS CORP0 citations58
US10978508B2Apr 13, 2021

Infrared detector having a directly bonded silicon substrate present on top thereof

L3 CINCINNATI ELECTRONICS CORP1 citations58
US10714531B2Jul 14, 2020

Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same

L3 CINCINNATI ELECTRONICS CORP1 citations58
US11515353B2Nov 29, 2022

Mechanically stacked multicolor focal plane arrays and detection devices

L3 CINCINNATI ELECTRONICS CORP0 citations57
US11411040B2Aug 9, 2022

Methods for fabricating mechanically stacked multicolor focal plane arrays and detection devices

L3 CINCINNATI ELECTRONICS CORP1 citations57
US10170653B2Jan 1, 2019

Tunneling barrier infrared detector devices

L3 CINCINNATI ELECTRONICS CORP0 citations51
US10121921B2Nov 6, 2018

Tunneling barrier infrared detector devices

L3 CINCINNATI ELECTRONICS CORP0 citations51

KONINKLIJKE PHILIPS NV

4 patents
US9660164B2May 23, 2017

Light emitting device with reduced epi stress

KONINKLIJKE PHILIPS NV0 citations52
US9755124B2Sep 5, 2017

LED module with high index lens

KONINKLIJKE PHILIPS NV0 citations51
US9722137B2Aug 1, 2017

LED having vertical contacts redistributed for flip chip mounting

KONINKLIJKE PHILIPS NV0 citations51
US9722161B2Aug 1, 2017

P-n separation metal fill for flip chip LEDs

KONINKLIJKE PHILIPS NV0 citations51

L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP

2 patents
US9515210B2Dec 6, 2016

Diode barrier infrared detector devices and superlattice barrier structures

L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP8 citations82
US9548408B2Jan 17, 2017

Tunneling barrier infrared detector devices

L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP2 citations71

WEI YAJUN

2 patents
US8400064B2Mar 19, 2013

Zener diode protection network in submount for LEDs connected in series

WEI YAJUN7 citations81
US8912049B2Dec 16, 2014

PEC biasing technique for LEDs

WEI YAJUN3 citations60

LEI JIPU

2 patents
US9246061B2Jan 26, 2016

LED having vertical contacts redistruted for flip chip mounting

LEI JIPU6 citations78
US9219209B2Dec 22, 2015

P-N separation metal fill for flip chip LEDs

LEI JIPU2 citations56

BIERHUIZEN SERGE J

1 patent
US9385285B2Jul 5, 2016

LED module with high index lens

BIERHUIZEN SERGE J5 citations71

L 3 COMM CINCINNATI ELECTRONICS CORP

1 patent
US9196769B2Nov 24, 2015

Superlattice structures and infrared detector devices incorporating the same

L 3 COMM CINCINNATI ELECTRONICS CORP4 citations71

LUMILEDS LLC

1 patent
US10170675B2Jan 1, 2019

P—N separation metal fill for flip chip LEDs

LUMILEDS LLC0 citations51

L 3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP

1 patent
US9887307B2Feb 6, 2018

Diode barrier infrared detector devices and barrier superlattice structures

L 3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP0 citations51

DIANA FREDERIC STEPHANE

1 patent
US9093630B2Jul 28, 2015

Light emitting device with reduced EPI stress

DIANA FREDERIC STEPHANE1 citations45