Inventor

SCHIAFFINO STEFANO

US44 patents

⚠️ This page may combine multiple inventors who share the name “SCHIAFFINO STEFANO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHIAFFINO STEFANO

FINISAR CORP

Flexible circuit for establishing electrical connectivity with optical subassembly

Header assembly having integrated cooling device

Optoelectronic components with multi-layer feedthrough structure

Small form factor transceiver with externally modulated laser

Multi-layer ceramic feedthrough structure in a transmitter optical subassembly

Cooled externally modulated laser for transmitter optical subassembly

Ceramic header assembly

Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly

Small form factor optical transceiver with extended transmission range

Header assembly for optoelectronic devices

Small form factor transceiver with externally modulated laser

Devices for reflection reduction in optical devices

KONINKLIJKE PHILIPS NV

Light emitting device with reduced epi stress

Sealed semiconductor light emitting device

LED having vertical contacts redistributed for flip chip mounting

P-n separation metal fill for flip chip LEDs

Semiconductor light emitting device with thick metal layers

Chip scale light emitting device with metal pillars in a molding compound formed at wafer level

Method of separating a wafer of semiconductor devices

HEWLETT PACKARD CO

Alignment of ink dots in an inkjet printer

Bubble valve and bubble valve-based pressure regulator

Correction system for droplet placement errors in the scan axis in inkjet printers

Selectively warming a printhead for optimized performance

Variable maximum operating temperature for a printhead

KONINKL PHILIPS ELECTRONICS NV

LED assembly having maximum metal support for laser lift-off of growth substrate

Electrical contacts for a semiconductor light emitting apparatus

Compliant bonding structures for semiconductor devices

Extension of contact pads to the die edge via electrical isolation

BIO RAD LABORATORIES INC

Microfluidic system with fluid pickups

Microfluidic system with fluid pickups

System, method, and device for forming an array of emulsions

PHILIPS LUMILEDS LIGHTING CO

Interconnects for semiconductor light emitting devices

LED assembly having maximum metal support for laser lift-off of growth substrate

AGILENT TECHNOLOGIES INC

Optical switching device and method utilizing fluid pressure control to improve switching characteristics

System and method for providing temperature control for a thermally activated optical switch using constant total power

BIO RAD LABORATORIES

Microfluidic system with fluid pickups

System, method, and device for forming an array of emulsions

NEFF JAMES G

Method of bonding a semiconductor device using a compliant bonding structure

Method of bonding a semiconductor device using a compliant bonding structure

LUMILEDS LLC

P—N separation metal fill for flip chip LEDs

Reducing solder pad topology differences by planarization

LEI JIPU

LED having vertical contacts redistruted for flip chip mounting

KONINKL PHILIPS NV

Semiconductor light emitting device with thick metal layers

DIANA FREDERIC STEPHANE

Light emitting device with reduced EPI stress