Inventor
SHEN HSING-LUNG
TW8 patents
Patents
8 patentsUS9972584B2May 15, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations70
US12473197B2Nov 18, 2025
Chip package
XINTEC INC0 citations60
US11873212B2Jan 16, 2024
Chip package and manufacturing method thereof
XINTEC INC0 citations60
US11137559B2Oct 5, 2021
Optical chip package and method for forming the same
XINTEC INC1 citations60
US10049252B2Aug 14, 2018
Chip package and fabrication method thereof
XINTEC INC0 citations51
US11107759B2Aug 31, 2021
Chip package and manufacturing method thereof
XINTEC INC0 citations50
US9793234B2Oct 17, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations40
US9548265B2Jan 17, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations36