Inventor
LAI JIUN-YEN
TW10 patents
Patents
10 patentsUS11309271B2Apr 19, 2022
Chip structure and manufacturing method thereof
XINTEC INC4 citations71
US9972584B2May 15, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations70
US11935859B2Mar 19, 2024
Chip structure and manufacturing method thereof
XINTEC INC0 citations61
US12473197B2Nov 18, 2025
Chip package
XINTEC INC0 citations60
US11873212B2Jan 16, 2024
Chip package and manufacturing method thereof
XINTEC INC0 citations60
US11387201B2Jul 12, 2022
Chip package and manufacturing method thereof
XINTEC INC0 citations60
US11137559B2Oct 5, 2021
Optical chip package and method for forming the same
XINTEC INC1 citations60
US11695199B2Jul 4, 2023
Antenna device and manufacturing method thereof
XINTEC INC0 citations59
US11107759B2Aug 31, 2021
Chip package and manufacturing method thereof
XINTEC INC0 citations50
US9761555B2Sep 12, 2017
Passive component structure and manufacturing method thereof
XINTEC INC0 citations39