Inventor

MAKI KEIICHI

JP69 patents

⚠️ This page may combine multiple inventors who share the name “MAKI KEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAKI KEIICHI

SKYWORKS SOLUTIONS INC

Acoustic wave device with spinel layer and temperature compensation layer

Acoustic wave device with multi-layer piezoelectric substrate

Method of manufacturing acoustic wave device with multi-layer substrate including ceramic

Acoustic wave devices on stacked die

Acoustic wave device with transverse mode suppression

Acoustic wave device with spinel layer and temperature compensation layer

Multi-layer piezoelectric substrate with heat dissipation

Acoustic wave device with spinel layer and temperature compensation layer

Acoustic wave devices on stacked die

Acoustic wave device with ceramic substrate

Surface acoustic wave resonator with multi-layer piezoelectric substrate with heat dissipation

Bulk acoustic wave resonator on surface acoustic wave device

Boundary acoustic wave device

Acoustic wave device with multi-layer substrate including ceramic

Multilayer piezoelectric substrate

Multilayer piezoelectric substrate with high density electrode

Multi-layer piezoelectric substrate with grounding structure

Multi-layer piezoelectric substrate with conductive layer

Rayleigh mode surface acoustic wave resonator

Multilayer piezoelectric substrate

Acoustic wave device with high thermal conductivity layer on interdigital transducer

Acoustic wave device with multi-layer interdigital transducer electrode having layer of more dense material over layer of less dense material

Acoustic wave filter with multiple acoustic wave devices on a subtrate

Acoustic wave device with multi-layer interdigital transducer electrode

Acoustic wave device with high thermal conductivity layer on interdigital transducer

Surface acoustic wave resonator with reduced frequency shift

Acoustic wave device with transverse mode suppression

Multi-layer piezoelectric substrate with conductive layer

Rayleigh mode surface acoustic wave resonator

Surface acoustic wave filters with suppressed cavity bending

Packaged surface acoustic wave device with conductive roof supporting structure

Surface acoustic wave device having a trapezoidal electrode

Acoustic wave device with multi-layer substrate including ceramic

Acoustic wave device with interdigital transducer electrode having buffer layer

Packaged surface acoustic wave device with conductive pillar

TOSHIBA HOKUTO ELECTRONICS CORP

Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device

Light emitting device and method for manufacturing the same

Light-emitting module

Light-emitting device

Light-emitting module

Light-emitting unit and manufacturing method of light-emitting unit

Light emitting device and manufacturing method thereof

Light-emitting device

Light emitting device

Light-emitting unit and manufacturing method of light-emitting unit

Light emitting module

Light emitting device and manufacturing method thereof

Light-emitting module

TOSHIBA HOKUTO ELECT CORP

Light emitting device and method for manufacturing the same

NICHIA CORP

Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device