Inventor
SHAH MILIND
US30 patents
⚠️ This page may combine multiple inventors who share the name “SHAH MILIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
18 patentsUS10510733B2Dec 17, 2019
Integrated device comprising embedded package on package (PoP) device
QUALCOMM INC11 citations84
US11652101B2May 16, 2023
Trench capacitor assembly for high capacitance density
QUALCOMM INC2 citations73
US11417637B2Aug 16, 2022
Stacked decoupling capacitors with integration in a substrate
QUALCOMM INC2 citations73
US11201127B2Dec 14, 2021
Device comprising contact to contact coupling of packages
QUALCOMM INC2 citations73
US11101228B1Aug 24, 2021
Integrated circuit package with a magnetic core
QUALCOMM INC2 citations73
US11670614B2Jun 6, 2023
Integrated circuit assembly with hybrid bonding
QUALCOMM INC3 citations72
US11239573B2Feb 1, 2022
Sub-module L-shaped millimeter wave antenna-in-package
QUALCOMM INC3 citations72
US12300655B2May 13, 2025
Integrated circuit assembly with hybrid bonding
QUALCOMM INC0 citations62
US11894366B2Feb 6, 2024
Trench capacitor assembly for high capacitance density
QUALCOMM INC0 citations62
US11776888B2Oct 3, 2023
Package with a substrate comprising protruding pad interconnects
QUALCOMM INC0 citations62
US11764489B2Sep 19, 2023
Sub-module L-shaped millimeter wave antenna-in-package
QUALCOMM INC0 citations62
US11296670B2Apr 5, 2022
Impedance matching transceiver
QUALCOMM INC0 citations62
US11189686B2Nov 30, 2021
Integrated device coupled to a capacitor structure comprising a trench capacitor
QUALCOMM INC0 citations62
US12046545B2Jul 23, 2024
Hybrid reconstituted substrate for electronic packaging
QUALCOMM INC0 citations52
US11817379B2Nov 14, 2023
Substrate comprising an inductor and a capacitor located in an encapsulation layer
QUALCOMM INC0 citations52
US11689181B2Jun 27, 2023
Package comprising stacked filters with a shared substrate cap
QUALCOMM INC0 citations52
US11320847B2May 3, 2022
Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication
QUALCOMM INC0 citations52
US10163871B2Dec 25, 2018
Integrated device comprising embedded package on package (PoP) device
QUALCOMM INC0 citations52
RF MICRO DEVICES INC
6 patentsUS7451539B2Nov 18, 2008
Method of making a conformal electromagnetic interference shield
RF MICRO DEVICES INC89 citations95
US6996892B1Feb 14, 2006
Circuit board embedded inductor
RF MICRO DEVICES INC103 citations95
US7999197B1Aug 16, 2011
Dual sided electronic module
RF MICRO DEVICES INC7 citations82
US7732253B1Jun 8, 2010
Flip-chip assembly with improved interconnect
RF MICRO DEVICES INC8 citations80
US6884661B1Apr 26, 2005
Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices
RF MICRO DEVICES INC8 citations72
US7474189B1Jan 6, 2009
Circuit board embedded inductor
RF MICRO DEVICES INC7 citations71