Inventor
JUN CHUNGSAM
KR15 patents
⚠️ This page may combine multiple inventors who share the name “JUN CHUNGSAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS9612212B1Apr 4, 2017
Ellipsometer and method of inspecting pattern asymmetry using the same
SAMSUNG ELECTRONICS CO LTD5 citations80
US9466537B2Oct 11, 2016
Method of inspecting semiconductor device and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD5 citations70
US9719946B2Aug 1, 2017
Ellipsometer and method of inspecting pattern asymmetry using the same
SAMSUNG ELECTRONICS CO LTD2 citations69
US9583402B2Feb 28, 2017
Method of manufacturing a semiconductor device using semiconductor measurement system
SAMSUNG ELECTRONICS CO LTD2 citations68
US12130242B2Oct 29, 2024
Inspection system of semiconductor wafer and method of driving the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11754510B2Sep 12, 2023
Inspection system of semiconductor wafer and method of driving the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US11988495B2May 21, 2024
Through-focus image-based metrology device, operation method thereof, and computing device for executing the operation
SAMSUNG ELECTRONICS CO LTD1 citations56
US11754517B2Sep 12, 2023
Inspection apparatus for inspecting semiconductor devices using charged particles
SAMSUNG ELECTRONICS CO LTD0 citations47
US12362139B2Jul 15, 2025
Semiconductor inspection apparatus and semiconductor inspection method using the same
SAMSUNG ELECTRONICS CO LTD0 citations45
US12352808B2Jul 8, 2025
Substrate inspection apparatus and substrate inspection method
SAMSUNG ELECTRONICS CO LTD0 citations44
US10269111B2Apr 23, 2019
Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations44
US12553834B2Feb 17, 2026
Substrate inspection method
SAMSUNG ELECTRONICS CO LTD0 citations42
US9892980B2Feb 13, 2018
Fan-out panel level package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations40
US10088297B2Oct 2, 2018
Apparatus and method for measuring thickness
SAMSUNG ELECTRONICS CO LTD0 citations36