Inventor

KASAI JUNICHI

JP102 patents

⚠️ This page may combine multiple inventors who share the name “KASAI JUNICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KASAI JUNICHI

FUJITSU LTD

Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame

Device having resin package with projections

Semiconductor device and method of producing the same

Semiconductor device having a plurality of chips

Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame

Semiconductor device having columnar electrode and method of manufacturing same

Semiconductor device including a frame terminal

Semiconductor device and semiconductor device unit for a stack arrangement

Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device

Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package

Semiconductor device with surface mount package adapted for vertical mounting

Method for fabricating solder bumps by forming solder balls with a solder ball forming member

Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method

Process for manufacturing a plural stacked leadframe semiconductor device

Semiconductor device having a plurality of chips

Semiconductor device having improved leads comprising palladium plated nickel

Semiconductor device having spherical terminals attached to the lead frame embedded within the package body

Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package

Semiconductor device having resin gate hole through substrate for resin encapsulation

Semiconductor device affixed to an upper and a lower leadframe

Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe

Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Wire bonded device with ball-shaped bonds

Semiconductor device having a die pad with rounded edges and its manufacturing method

Method of producing semiconductor device having radiation part made of resin containing insulator powders

Method and apparatus for a semiconductor device having a radiation part

Device having resin package and method of producing the same

Semiconductor module including a plurality of semiconductor devices detachably

Bump-forming method using two plates and electronic device

Semiconductor module including a plurality of semiconductor devices detachably

Semiconductor device having a ball grid array and a fabrication process thereof

Method for fabricating bump forming plate member

Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit

Semiconductor device and semiconductor device unit

Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device

NISSAN MOTOR

Audio speaker system for automotive vehicle

Vehicle alarm system for informing other vehicles of its own presence

Audio equipment

Speaker for automotive vehicle audio system having a vehicle panel serving as sound-amplifying medium

Household power supply system using electric vehicle

Vehicle panel speaker for automotive audio system utilizing part of a vehicle panel as a sound-producing medium

Distance measuring apparatus

Automotive multi-speaker audio system with different timing reproduction of audio sound

Woofer system for an automotive audio system with a protecter therefor

Stereo signal reproducing system

Automotive multi-speaker audio system with automatic echo-control feature

SPANSION LLC

Semiconductor device and method of manufacturing the same

Carrier for stacked type semiconductor device and method of fabricating the same