Inventor
ONODERA MASANORI
JP63 patents
⚠️ This page may combine multiple inventors who share the name “ONODERA MASANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
19 patentsUS6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US6218281B1Apr 17, 2001
Semiconductor device with flip chip bonding pads and manufacture thereof
FUJITSU LTD162 citations98
US6025650AFeb 15, 2000
Semiconductor device including a frame terminal
FUJITSU LTD220 citations98
US6329711B1Dec 11, 2001
Semiconductor device and mounting structure
FUJITSU LTD122 citations96
US6159770ADec 12, 2000
Method and apparatus for fabricating semiconductor device
FUJITSU LTD212 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US6541848B2Apr 1, 2003
Semiconductor device including stud bumps as external connection terminals
FUJITSU LTD58 citations94
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US6798031B2Sep 28, 2004
Semiconductor device and method for making the same
FUJITSU LTD39 citations92
US6600217B2Jul 29, 2003
Mounting substrate and mounting method for semiconductor device
FUJITSU LTD22 citations91
US6420213B1Jul 16, 2002
Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive
FUJITSU LTD27 citations91
US6372392B1Apr 16, 2002
Transparent optical device and fabrication method thereof
FUJITSU LTD20 citations90
US6373140B1Apr 16, 2002
Semiconductor device
FUJITSU LTD26 citations86
US7202460B2Apr 10, 2007
Camera module for compact electronic equipments
FUJITSU LTD15 citations84
US7282693B2Oct 16, 2007
Camera module for compact electronic equipments
FUJITSU LTD3 citations63
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63
SPANSION LLC
16 patentsUS7626253B2Dec 1, 2009
Computing device including a stacked semiconductor device
SPANSION LLC19 citations93
US7605457B2Oct 20, 2009
Semiconductor device and method of manufacturing the same
SPANSION LLC18 citations92
US7285848B2Oct 23, 2007
Carrier for stacked type semiconductor device and method of fabricating the same
SPANSION LLC19 citations92
US7968990B2Jun 28, 2011
Semiconductor device and method of fabricating the same
SPANSION LLC7 citations84
US7964446B2Jun 21, 2011
Semiconductor device and method of manufacturing the same
SPANSION LLC8 citations84
US7834470B2Nov 16, 2010
Semiconductor device and programming method
SPANSION LLC9 citations84
US7683473B2Mar 23, 2010
Semiconductor device, fabrication method therefor, and film fabrication method
SPANSION LLC14 citations84
US8030179B2Oct 4, 2011
Semiconductor device and method of manufacturing the same
SPANSION LLC8 citations83
US7846829B2Dec 7, 2010
Stacked solder balls for integrated circuit device packaging and assembly
SPANSION LLC8 citations83
US7859096B2Dec 28, 2010
Semiconductor device
SPANSION LLC6 citations74
US7566978B2Jul 28, 2009
Semiconductor device and programming method
SPANSION LLC5 citations74
US8900928B2Dec 2, 2014
Semiconductor device and programming method
SPANSION LLC1 citations63
US7696616B2Apr 13, 2010
Stacked type semiconductor device and method of fabricating stacked type semiconductor device
SPANSION LLC4 citations63
US7642637B2Jan 5, 2010
Carrier for stacked type semiconductor device and method of fabricating the same
SPANSION LLC2 citations63
US9312252B2Apr 12, 2016
Method of manufacturing a semiconductor device having a chip mounted on an interposer
SPANSION LLC0 citations52
US9245774B2Jan 26, 2016
Semiconductor device and method of manufacturing the same
SPANSION LLC0 citations52
ONODERA MASANORI
5 patentsUS8531019B2Sep 10, 2013
Heat dissipation methods and structures for semiconductor device
ONODERA MASANORI5 citations73
US8330263B2Dec 11, 2012
Semiconductor device
ONODERA MASANORI3 citations73
US9508651B2Nov 29, 2016
Semiconductor device and method of manufacturing the same
ONODERA MASANORI2 citations62
US8637997B2Jan 28, 2014
Semiconductor device and method of manufacturing the same
ONODERA MASANORI2 citations62
US8329562B2Dec 11, 2012
Methods of making a semiconductor device
ONODERA MASANORI2 citations62
HOSHINO MASATAKA
2 patentsCYPRESS SEMICONDUCTOR CORP
2 patentsTAYA KOJI
2 patentsMICRONICS JAPAN CO LTD
1 patentFUJITSU MICROELECTRONICS LTD
1 patentVALLEY DEVICE MAN
1 patentSHINMA YASUHIRO
1 patentShowing the top 50 of 63 patents by PatentIndex Score.