Inventor
KANEDA AIZO
JP50 patents
⚠️ This page may combine multiple inventors who share the name “KANEDA AIZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
44 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US5334875AAug 2, 1994
Stacked semiconductor memory device and semiconductor memory module containing the same
HITACHI LTD128 citations98
US5198888AMar 30, 1993
Semiconductor stacked device
HITACHI LTD353 citations98
US5184208AFeb 2, 1993
Semiconductor device
HITACHI LTD115 citations98
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5219765AJun 15, 1993
Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
HITACHI LTD160 citations96
US5028986AJul 2, 1991
Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
HITACHI LTD115 citations95
US5059559AOct 22, 1991
Method of aligning and bonding tab inner leads
HITACHI LTD88 citations94
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US4954301ASep 4, 1990
Transfer molding process and an apparatus for the same
HITACHI LTD31 citations93
US4946633AAug 7, 1990
Method of producing semiconductor devices
HITACHI LTD32 citations93
US4900501AFeb 13, 1990
Method and apparatus for encapsulating semi-conductors
HITACHI LTD31 citations93
US4426341AJan 17, 1984
Transfer molding method and transfer molding machine
HITACHI LTD34 citations92
US4484796ANov 27, 1984
Optical fiber connector
HITACHI LTD134 citations91
US4411609AOct 25, 1983
Apparatus for molding plastic
HITACHI LTD51 citations91
US4802831AFeb 7, 1989
Fluid machine with resin-coated scroll members
HITACHI LTD46 citations90
US4126292ANov 21, 1978
Mold die
HITACHI LTD51 citations89
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US5365113ANov 15, 1994
Semiconductor device
HITACHI LTD15 citations82
US4239944ADec 16, 1980
Spider of loudspeaker
HITACHI LTD24 citations81
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US5742101AApr 21, 1998
Semiconductor device
HITACHI LTD9 citations74
US5514905AMay 7, 1996
Semiconductor device
HITACHI LTD13 citations74
US5110515AMay 5, 1992
Method of encapsulating semiconductor chips
HITACHI LTD19 citations74
US5125821AJun 30, 1992
Resin flow and curing measuring device
HITACHI LTD19 citations73
US4786802ANov 22, 1988
Apparatus for measuring photoelasticity
HITACHI LTD19 citations72
US6100115AAug 8, 2000
Semiconductor device
HITACHI LTD1 citations63
US4810089AMar 7, 1989
Photoelastic effect measuring device
HITACHI LTD6 citations60
US6204552B1Mar 20, 2001
Semiconductor device
HITACHI LTD0 citations52
US4524369AJun 18, 1985
Plastic information-recording medium
HITACHI LTD0 citations41
US4322593AMar 30, 1982
Apparatus for pre-heating resin tablet
HITACHI LTD0 citations37
HITACHI CHEMICAL CO LTD
2 patentsUS6265782B1Jul 24, 2001
Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
HITACHI CHEMICAL CO LTD99 citations97
US6621170B2Sep 16, 2003
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
HITACHI CHEMICAL CO LTD29 citations92