Inventor
MAYER JAMES W
US12 patents
⚠️ This page may combine multiple inventors who share the name “MAYER JAMES W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CORNELL RES FOUNDATION INC
6 patentsUS5447599ASep 5, 1995
Self-aligned process for capping copper lines
CORNELL RES FOUNDATION INC53 citations96
US5023201AJun 11, 1991
Selective deposition of tungsten on TiSi2
CORNELL RES FOUNDATION INC57 citations94
US5310602AMay 10, 1994
Self-aligned process for capping copper lines
CORNELL RES FOUNDATION INC31 citations92
US5277985AJan 11, 1994
Process for fabricating copper interconnects in ultra large scale integrated (ULSI) circuits
CORNELL RES FOUNDATION INC41 citations92
US5627427AMay 6, 1997
Silicon tip field emission cathodes
CORNELL RES FOUNDATION INC41 citations91
US5138432AAug 11, 1992
Selective deposition of tungsten on TiSi2
CORNELL RES FOUNDATION INC22 citations91
UNIV ARIZONA
2 patentsUS6750124B1Jun 15, 2004
Direct patterning of nanometer-scale silicide structures on silicon by ion-beam implantation through a thin barrier layer
UNIV ARIZONA9 citations66
US7541261B2Jun 2, 2009
Flexible electronics using ion implantation to adhere polymer substrate to single crystal silicon substrate
UNIV ARIZONA0 citations50