Inventor
CORONEL PHILIPPE
FR98 patents
⚠️ This page may combine multiple inventors who share the name “CORONEL PHILIPPE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS SA
12 patentsUS7687872B2Mar 30, 2010
Back-lit image sensor with a uniform substrate temperature
ST MICROELECTRONICS SA189 citations99
US6828646B2Dec 7, 2004
Isolating trench and manufacturing process
ST MICROELECTRONICS SA96 citations97
US6969878B2Nov 29, 2005
Surround-gate semiconductor device encapsulated in an insulating medium
ST MICROELECTRONICS SA46 citations92
US6846690B2Jan 25, 2005
Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
ST MICROELECTRONICS SA26 citations92
US6689655B2Feb 10, 2004
Method for production process for the local interconnection level using a dielectric conducting pair on pair
ST MICROELECTRONICS SA22 citations91
US7687833B2Mar 30, 2010
Component containing a baw filter
ST MICROELECTRONICS SA11 citations83
US7141837B2Nov 28, 2006
High-density MOS transistor
ST MICROELECTRONICS SA10 citations72
US6740919B2May 25, 2004
Ram
ST MICROELECTRONICS SA8 citations71
US7691727B2Apr 6, 2010
Method for manufacturing an integrated circuit with fully depleted and partially depleted transistors
ST MICROELECTRONICS SA2 citations63
US7456071B2Nov 25, 2008
Method for forming a strongly-conductive buried layer in a semiconductor substrate
ST MICROELECTRONICS SA6 citations62
US7638844B2Dec 29, 2009
Manufacturing method of semiconductor-on-insulator region structures
ST MICROELECTRONICS SA1 citations52
US7214597B2May 8, 2007
Electronic components and method of fabricating the same
ST MICROELECTRONICS SA0 citations52
COMMISSARIAT ENERGIE ATOMIQUE
9 patentsUS7910419B2Mar 22, 2011
SOI transistor with self-aligned ground plane and gate and buried oxide of variable thickness
COMMISSARIAT ENERGIE ATOMIQUE110 citations98
US9735707B2Aug 15, 2017
Thermal energy harvesting optimisation with bistable elements and collaborative behavior
COMMISSARIAT ENERGIE ATOMIQUE6 citations82
US9793162B2Oct 17, 2017
Method for producing interconnections for 3D integrated circuit
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US9667121B2May 30, 2017
Device for converting heat energy into electrical energy with heat-sensitive molecules
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US10115637B2Oct 30, 2018
Method for fabricating auto-aligned interconnection elements for a 3D integrated circuit
COMMISSARIAT ENERGIE ATOMIQUE3 citations72
US10350461B2Jul 16, 2019
Device with deformable shell including an internal piezoelectric circuit
COMMISSARIAT ENERGIE ATOMIQUE4 citations67
US8383464B2Feb 26, 2013
Method for producing field effect transistors with a back gate and semiconductor device
COMMISSARIAT ENERGIE ATOMIQUE2 citations63
US10153064B2Dec 11, 2018
Graphene interposer and method of manufacturing such an interposer
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US9966879B2May 8, 2018
Thermal energy harvesting optimization with bistable elements and collaborative behavior
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
IBM
8 patentsUS5658418AAug 19, 1997
Apparatus for monitoring the dry etching of a dielectric film to a given thickness in an integrated circuit
IBM160 citations98
US6363294B1Mar 26, 2002
Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
IBM491 citations96
US5807761ASep 15, 1998
Method for real-time in-situ monitoring of a trench formation process
IBM80 citations96
US6342452B1Jan 29, 2002
Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a mask
IBM54 citations94
US5874345AFeb 23, 1999
Method for planarizing TEOS SiO2 filled shallow isolation trenches
IBM32 citations90
US6417072B2Jul 9, 2002
Method of forming STI oxide regions and alignment marks in a semiconductor structure with one masking step
IBM20 citations88
US6281068B1Aug 28, 2001
Method for buried plate formation in deep trench capacitors
IBM36 citations87
US6297089B1Oct 2, 2001
Method of forming buried straps in DRAMs
IBM14 citations71
ST MICROELECTRONICS CROLLES 2
7 patentsUS8039332B2Oct 18, 2011
Method of manufacturing a buried-gate semiconductor device and corresponding integrated circuit
ST MICROELECTRONICS CROLLES 2123 citations93
US7804134B2Sep 28, 2010
MOSFET on SOI device
ST MICROELECTRONICS CROLLES 216 citations84
US7687356B2Mar 30, 2010
Formation of shallow siGe conduction channel
ST MICROELECTRONICS CROLLES 210 citations83
US7556995B2Jul 7, 2009
MOS transistor manufacturing
ST MICROELECTRONICS CROLLES 210 citations82
US7977187B2Jul 12, 2011
Method of fabricating a buried-gate semiconductor device and corresponding integrated circuit
ST MICROELECTRONICS CROLLES 24 citations60
US7915110B2Mar 29, 2011
MOS transistor manufacturing
ST MICROELECTRONICS CROLLES 24 citations60
US7960255B2Jun 14, 2011
Process for forming a wire portion in an integrated electronic circuit
ST MICROELECTRONICS CROLLES 23 citations58
SAVELLI GUILLAUME
3 patentsUS9054272B2Jun 9, 2015
Optimized thermoelectric module for operation in peltier mode or in seebeck mode
SAVELLI GUILLAUME4 citations71
US9301423B2Mar 29, 2016
Cooling device equipped with a thermoelectric sensor
SAVELLI GUILLAUME2 citations61
US8962969B2Feb 24, 2015
Modulatable thermoelectric device
SAVELLI GUILLAUME2 citations61
CORONEL PHILIPPE
2 patentsPERRAUD SIMON
1 patentNXP BV
1 patentOUKASSI SAMI
1 patentPHAN HAI TRIEU
1 patentMULLER MARKUS GERHARD ANDREAS
1 patentCOMMISSARIAT A L ERNERGIE ATOM
1 patentWACQUEZ ROMAIN
1 patentCOUDRAIN PERCEVAL
1 patentGWOZIECKI ROMAIN
1 patentShowing the top 50 of 98 patents by PatentIndex Score.