Inventor

TSAI HONG-HSIANG

TW7 patents

⚠️ This page may combine multiple inventors who share the name “TSAI HONG-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VANGUARD INT SEMICONDUCT CORP

4 patents

US5917748AJun 29, 1999

Multi-level DRAM sensing scheme

VANGUARD INT SEMICONDUCT CORP23 citations92

US5763306AJun 9, 1998

Method of fabricating capacitor over bit line COB structure for a very high density DRAM applications

VANGUARD INT SEMICONDUCT CORP52 citations90

US6072218AJun 6, 2000

Low capacitance input/output integrated circuit

VANGUARD INT SEMICONDUCT CORP6 citations71

US5691213ANov 25, 1997

Low capacitance input/output integrated circuit

VANGUARD INT SEMICONDUCT CORP12 citations71

WINBOND ELECTRONICS CORP

2 patents

US6423594B1Jul 23, 2002

Method of fabricating deep trench capacitor

WINBOND ELECTRONICS CORP7 citations72

US6352896B1Mar 5, 2002

Method of manufacturing DRAM capacitor

WINBOND ELECTRONICS CORP13 citations72

CHIAN MING-CHUNG

1 patent

US8072067B2Dec 6, 2011

Semiconductor structure

CHIAN MING-CHUNG1 citations35