Inventor

TOPACIO RODEN R

CA21 patents

⚠️ This page may combine multiple inventors who share the name “TOPACIO RODEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOPACIO RODEN R

TOPACIO RODEN R

Method of fabricating a semiconductor chip with supportive terminal pad

Methods of fabricating semiconductor chip solder structures

Semiconductor chip with patterned underbump metallization and polymer film

Methods of forming semiconductor chip underfill anchors

Methods of forming semiconductor chip underfill anchors

Interconnect etch with polymer layer edge protection

Interconnect etch with polymer layer edge protection

Methods of fabricating semiconductor chip solder structures

Conductor bump method and apparatus

ATI TECHNOLOGIES ULC

Semiconductor chip bump connection apparatus and method

Semiconductor chip with contoured solder structure opening

Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same

Semiconductor chip with patterned underbump metallization and polymer film

Semiconductor chip passivation structures and methods of making the same

Semiconductor chip passivation structures and methods of making the same

Semiconductor chip bump connection apparatus and method

LEUNG ANDREW

Method of manufacturing substrates having asymmetric buildup layers

MCLELLAN NEIL R

Integrated package circuit with stiffener

MARTINEZ LIANE

Face-to-face (F2F) hybrid structure for an integrated circuit

ADVANCED MICRO DEVICES INC

Conductor bump method and apparatus

LEUNG ANDREW K W

Solder mask with anchor structures