Inventor
MCLELLAN NEIL
CA70 patents
⚠️ This page may combine multiple inventors who share the name “MCLELLAN NEIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASAT LTD
33 patentsUS7372151B1May 13, 2008
Ball grid array package and process for manufacturing same
ASAT LTD461 citations99
US6995460B1Feb 7, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD119 citations99
US6989294B1Jan 24, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD101 citations99
US6946324B1Sep 20, 2005
Process for fabricating a leadless plastic chip carrier
ASAT LTD182 citations99
US6933176B1Aug 23, 2005
Ball grid array package and process for manufacturing same
ASAT LTD121 citations99
US6635957B2Oct 21, 2003
Leadless plastic chip carrier with etch back pad singulation and die attach pad array
ASAT LTD199 citations99
US6545347B2Apr 8, 2003
Enhanced leadless chip carrier
ASAT LTD148 citations99
US7371610B1May 13, 2008
Process for fabricating an integrated circuit package with reduced mold warping
ASAT LTD79 citations98
US6987032B1Jan 17, 2006
Ball grid array package and process for manufacturing same
ASAT LTD126 citations98
US6933594B2Aug 23, 2005
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD140 citations98
US6498099B1Dec 24, 2002
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD519 citations98
US6294100B1Sep 25, 2001
Exposed die leadless plastic chip carrier
ASAT LTD349 citations98
US6242281B1Jun 5, 2001
Saw-singulated leadless plastic chip carrier
ASAT LTD413 citations98
US6229200B1May 8, 2001
Saw-singulated leadless plastic chip carrier
ASAT LTD556 citations98
US7358119B2Apr 15, 2008
Thin array plastic package without die attach pad and process for fabricating the same
ASAT LTD78 citations97
US7315080B1Jan 1, 2008
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
ASAT LTD76 citations97
US7224048B1May 29, 2007
Flip chip ball grid array package
ASAT LTD65 citations97
US6737755B1May 18, 2004
Ball grid array package with improved thermal characteristics
ASAT LTD109 citations97
US7411289B1Aug 12, 2008
Integrated circuit package with partially exposed contact pads and process for fabricating the same
ASAT LTD101 citations96
US7342305B1Mar 11, 2008
Thermally enhanced cavity-down integrated circuit package
ASAT LTD64 citations96
US7091581B1Aug 15, 2006
Integrated circuit package and process for fabricating the same
ASAT LTD122 citations96
US6984785B1Jan 10, 2006
Thermally enhanced cavity-down integrated circuit package
ASAT LTD75 citations96
US6585905B1Jul 1, 2003
Leadless plastic chip carrier with partial etch die attach pad
ASAT LTD226 citations96
US7247526B1Jul 24, 2007
Process for fabricating an integrated circuit package
ASAT LTD134 citations95
US6841859B1Jan 11, 2005
Premolded cavity IC package
ASAT LTD82 citations94
US6429048B1Aug 6, 2002
Metal foil laminated IC package
ASAT LTD78 citations94
US6667191B1Dec 23, 2003
Chip scale integrated circuit package
ASAT LTD62 citations93
US7270867B1Sep 18, 2007
Leadless plastic chip carrier
ASAT LTD34 citations92
US7271032B1Sep 18, 2007
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD43 citations92
US7232755B1Jun 19, 2007
Process for fabricating pad frame and integrated circuit package
ASAT LTD20 citations92
US7226811B1Jun 5, 2007
Process for fabricating a leadless plastic chip carrier
ASAT LTD55 citations92
US6872661B1Mar 29, 2005
Leadless plastic chip carrier with etch back pad singulation and die attach pad array
ASAT LTD53 citations92
US6821817B1Nov 23, 2004
Premolded cavity IC package
ASAT LTD25 citations89
DALLAS SEMICONDUCTOR
5 patentsUSD384336SSep 30, 1997
Power cap cover
DALLAS SEMICONDUCTOR25 citations92
US6021046AFeb 1, 2000
Thermal protection of electrical elements systems
DALLAS SEMICONDUCTOR25 citations91
US5913552AJun 22, 1999
Method of providing thermal protection of electrical elements
DALLAS SEMICONDUCTOR23 citations91
US5528463AJun 18, 1996
Low profile sockets and modules for surface mountable applications
DALLAS SEMICONDUCTOR19 citations90
US5647121AJul 15, 1997
Method of assembling electronic component
DALLAS SEMICONDUCTOR18 citations88
ATI TECHNOLOGIES ULC
3 patentsUS7994044B2Aug 9, 2011
Semiconductor chip with contoured solder structure opening
ATI TECHNOLOGIES ULC8 citations84
US7985621B2Jul 26, 2011
Method and apparatus for making semiconductor packages
ATI TECHNOLOGIES ULC8 citations83
US8344505B2Jan 1, 2013
Wafer level packaging of semiconductor chips
ATI TECHNOLOGIES ULC13 citations81
MCLELLAN NEIL
3 patentsTOPACIO RODEN R
1 patentFAN CHUN HO
1 patentLIN GERALDINE TSUI YEE
1 patentADVANCED MICRO DEVICES INC
1 patentSU MICHAEL
1 patentLEUNG ANDREW K W
1 patentShowing the top 50 of 70 patents by PatentIndex Score.