Inventor
NOBLE JR WENDELL P
US25 patents
⚠️ This page may combine multiple inventors who share the name “NOBLE JR WENDELL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS5539229AJul 23, 1996
MOSFET with raised STI isolation self-aligned to the gate stack
IBM130 citations98
US4380057AApr 12, 1983
Electrically alterable double dense memory
IBM170 citations97
US6090660AJul 18, 2000
Method of fabricating a gate connector
IBM44 citations96
US5512767AApr 30, 1996
Trench capacitor field shield with sidewall contact
IBM51 citations96
US6022781AFeb 8, 2000
Method for fabricating a MOSFET with raised STI isolation self-aligned to the gate stack
IBM57 citations95
US4873205AOct 10, 1989
Method for providing silicide bridge contact between silicon regions separated by a thin dielectric
IBM111 citations94
US6175128B1Jan 16, 2001
Process for building borderless bitline, wordline and DRAM structure and resulting structure
IBM17 citations93
US6252267B1Jun 26, 2001
Five square folded-bitline DRAM cell
IBM31 citations92
US4675982AJun 30, 1987
Method of making self-aligned recessed oxide isolation regions
IBM22 citations82
US6271555B1Aug 7, 2001
Borderless wordline for DRAM cell
IBM11 citations74
US6261933B1Jul 17, 2001
Process for building borderless bitline, wordline amd DRAM structure
IBM8 citations74
US4222816ASep 16, 1980
Method for reducing parasitic capacitance in integrated circuit structures
IBM7 citations66
US6420748B1Jul 16, 2002
Borderless bitline and wordline DRAM structure
IBM2 citations63
US6121128ASep 19, 2000
Method for making borderless wordline for DRAM cell
IBM3 citations63
US4609429ASep 2, 1986
Process for making a small dynamic memory cell structure
IBM2 citations62
MICRON TECHNOLOGY INC
9 patentsUS6225165B1May 1, 2001
High density SRAM cell with latched vertical transistors
MICRON TECHNOLOGY INC188 citations99
US6104045AAug 15, 2000
High density planar SRAM cell using bipolar latch-up and gated diode breakdown
MICRON TECHNOLOGY INC145 citations99
US6545297B1Apr 8, 2003
High density vertical SRAM cell using bipolar latchup induced by gated diode breakdown
MICRON TECHNOLOGY INC92 citations98
US6128216AOct 3, 2000
High density planar SRAM cell with merged transistors
MICRON TECHNOLOGY INC116 citations98
US6964903B2Nov 15, 2005
Method of fabricating a transistor on a substrate to operate as a fully depleted structure
MICRON TECHNOLOGY INC57 citations96
US6773968B1Aug 10, 2004
High density planar SRAM cell using bipolar latch-up and gated diode breakdown
MICRON TECHNOLOGY INC23 citations93
US6503790B2Jan 7, 2003
High density vertical SRAM cell using bipolar latchup induced by gated diode breakdown
MICRON TECHNOLOGY INC12 citations74
US7105386B2Sep 12, 2006
High density SRAM cell with latched vertical transistors
MICRON TECHNOLOGY INC1 citations63
US6936886B2Aug 30, 2005
High density SRAM cell with latched vertical transistors
MICRON TECHNOLOGY INC3 citations63