Inventor
MA MANNY KIN F
US29 patents
Patents
29 patentsUS5677567AOct 14, 1997
Leads between chips assembly
MICRON TECHNOLOGY INC93 citations97
US6208018B1Mar 27, 2001
Piggyback multiple dice assembly
MICRON TECHNOLOGY INC80 citations96
US6078538AJun 20, 2000
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC29 citations96
US5894165AApr 13, 1999
Leads between chips assembly
MICRON TECHNOLOGY INC45 citations96
US5770480AJun 23, 1998
Method of leads between chips assembly
MICRON TECHNOLOGY INC35 citations96
US6472893B2Oct 29, 2002
Test socket and methods
MICRON TECHNOLOGY INC14 citations93
US6682954B1Jan 27, 2004
Method for employing piggyback multiple die #3
MICRON TECHNOLOGY INC25 citations92
US6204537B1Mar 20, 2001
ESD protection scheme
MICRON TECHNOLOGY INC39 citations92
US6194235B1Feb 27, 2001
Method of fabricating and testing an embedded semiconductor device
MICRON TECHNOLOGY INC22 citations92
US6068892AMay 30, 2000
Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit
MICRON TECHNOLOGY INC21 citations92
US6054334AApr 25, 2000
Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit
MICRON TECHNOLOGY INC25 citations92
US6232148B1May 15, 2001
Method and apparatus leads-between-chips
MICRON TECHNOLOGY INC31 citations90
US6310802B1Oct 30, 2001
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC10 citations82
US6707096B2Mar 16, 2004
Fork-like memory structure for ULSI DRAM and method of fabrication
MICRON TECHNOLOGY INC5 citations74
US6350634B2Feb 26, 2002
Semiconductor device having a built-in heat sink and process of manufacturing same
MICRON TECHNOLOGY INC12 citations74
US6303445B1Oct 16, 2001
Method of ESD protection scheme
MICRON TECHNOLOGY INC9 citations74
US6262583B1Jul 17, 2001
Test socket and methods
MICRON TECHNOLOGY INC10 citations74
US6236116B1May 22, 2001
Semiconductor device having a built-in heat sink and process of manufacturing same
MICRON TECHNOLOGY INC12 citations74
US6226221B1May 1, 2001
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC7 citations74
US6118291ASep 12, 2000
Test socket and methods
MICRON TECHNOLOGY INC5 citations74
US6724033B1Apr 20, 2004
Fork-like memory structure for ULSI DRAM
MICRON TECHNOLOGY INC3 citations63
US6631091B2Oct 7, 2003
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC2 citations63
US6625068B1Sep 23, 2003
Apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC2 citations63
US6442101B2Aug 27, 2002
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC2 citations63
US6434059B1Aug 13, 2002
Method and apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC2 citations63
US6340896B2Jan 22, 2002
Test socket and methods
MICRON TECHNOLOGY INC2 citations63
US6010932AJan 4, 2000
Fork-like memory structure for ULSI DRAM and method of fabrication
MICRON TECHNOLOGY INC3 citations63
US6888762B2May 3, 2005
Apparatus for reducing bleed currents within a DRAM array having row-to-column shorts
MICRON TECHNOLOGY INC0 citations52
US6593764B2Jul 15, 2003
Test socket and methods
MICRON TECHNOLOGY INC0 citations52