Inventor

BOLKEN TODD O

US93 patents

⚠️ This page may combine multiple inventors who share the name “BOLKEN TODD O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOLKEN TODD O

MICRON TECHNOLOGY INC

Image sensor packages

Semiconductor component having stacked, encapsulated dice

Semiconductor card and method of fabrication

Two stage transfer molding method to encapsulate MMC module

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Packages for semiconductor die

Stackable ball grid array

Controlling packaging encapsulant leakage

Semiconductor component having encapsulated die stack

Method for fabricating semiconductor component having stacked, encapsulated dice

Method for assembling semiconductor die packages with standard ball grid array footprint

Techniques for packaging multiple device components

Microelectronic devices and microelectronic die packages

Method and apparatus for packaging a microelectronic die

Apparatus for reduced flash encapsulation of microelectronic devices

Method and apparatus for reduced flash encapsulation of microelectronic devices

Method and apparatus for packaging a microelectronic die

Method and apparatus for encapsulating a multi-chip substrate array

Molded ball grid array

Method and apparatus for reduced flash encapsulation of microelectronic devices

Asymmetrical mold of multiple-part matrixes

Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

Method for assembling semiconductor die packages with standard ball grid array footprint

Semiconductor component having stacked, encapsulated dice and method of fabrication

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interactive electronic devices

Techniques for packaging a multiple device component

Method of manufacturing a stackable ball grid array

Flip chip integrated package mount support

Methods and apparatus for packaging semiconductor devices

Apparatus for encapsulating a multi-chip substrate array

Sealed electronic device packages with transparent coverings

Semiconductor assembly encapsulation mold

Method and apparatus for packaging a microelectronic die

Semiconductor package with molded flash

Semiconductor die packages with standard ball grid array footprint and method for assembling the same

Ball grid array packages with thermally conductive containers

Two-stage transfer molding method to encapsulate MMC module

Interposers having encapsulant fill control features

Packages for semiconductor die

Manual pellet loader for Boschman automolds

Moisture-resistant electronic device package and methods of assembly

Moisture-resistant electronic device package and methods of assembly

Methods for molding a semiconductor die package with enhanced thermal conductivity

Controlling packaging encapsulant leakage

Molded ball grid array

Techniques for packaging a multiple device component

Interposers for semiconductor die packages with standard ball grill array footprint

Overmolding encapsulation process and encapsulated article made therefrom

ROUND ROCK RES LLC

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor