Inventor
BAERLOCHER CARY J
US32 patents
⚠️ This page may combine multiple inventors who share the name “BAERLOCHER CARY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
27 patentsUS6329220B1Dec 11, 2001
Packages for semiconductor die
MICRON TECHNOLOGY INC161 citations99
US6778404B1Aug 17, 2004
Stackable ball grid array
MICRON TECHNOLOGY INC75 citations98
US6644949B2Nov 11, 2003
Apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC51 citations96
US6638595B2Oct 28, 2003
Method and apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC52 citations96
US6365434B1Apr 2, 2002
Method and apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC67 citations96
US7101730B2Sep 5, 2006
Method of manufacturing a stackable ball grid array
MICRON TECHNOLOGY INC24 citations93
US6518654B1Feb 11, 2003
Packages for semiconductor die
MICRON TECHNOLOGY INC15 citations93
US7276802B2Oct 2, 2007
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC21 citations92
US7268067B2Sep 11, 2007
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC21 citations92
US7262074B2Aug 28, 2007
Methods of fabricating underfilled, encapsulated semiconductor die assemblies
MICRON TECHNOLOGY INC21 citations92
US7026548B2Apr 11, 2006
Moisture-resistant electronic device package and methods of assembly
MICRON TECHNOLOGY INC22 citations92
US6953891B2Oct 11, 2005
Moisture-resistant electronic device package and methods of assembly
MICRON TECHNOLOGY INC31 citations92
US7459773B2Dec 2, 2008
Stackable ball grid array
MICRON TECHNOLOGY INC7 citations74
US7239029B2Jul 3, 2007
Packages for semiconductor die
MICRON TECHNOLOGY INC7 citations74
US7144245B2Dec 5, 2006
Packages for semiconductor die
MICRON TECHNOLOGY INC4 citations74
US7091060B2Aug 15, 2006
Circuit and substrate encapsulation methods
MICRON TECHNOLOGY INC10 citations74
US7019408B2Mar 28, 2006
Stackable ball grid array
MICRON TECHNOLOGY INC4 citations74
US7468559B2Dec 23, 2008
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC5 citations73
US7095097B2Aug 22, 2006
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC6 citations73
US6887740B2May 3, 2005
Method for making an integrated circuit package having reduced bow
MICRON TECHNOLOGY INC4 citations73
US7851907B2Dec 14, 2010
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC2 citations62
US7342319B2Mar 11, 2008
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
MICRON TECHNOLOGY INC3 citations62
US7116000B2Oct 3, 2006
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
MICRON TECHNOLOGY INC4 citations62
US6577018B1Jun 10, 2003
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC3 citations62
US7423331B2Sep 9, 2008
Molded stiffener for thin substrates
MICRON TECHNOLOGY INC0 citations52
US7344921B2Mar 18, 2008
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC0 citations52
US7288431B2Oct 30, 2007
Molded stiffener for thin substrates
MICRON TECHNOLOGY INC1 citations52