Inventor

TANG XIANMIN

US106 patents

⚠️ This page may combine multiple inventors who share the name “TANG XIANMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANG XIANMIN

APPLIED MATERIALS INC

Methods for pre-cleaning conductive interconnect structures

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Method of depositing a TaN seed layer

Low resistivity tungsten PVD with enhanced ionization and RF power coupling

Shields usable with an inductively coupled plasma reactor

Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith

Target for PVD sputtering system

Cleaning of sin with CCP plasma or RPS clean

Metal / metal nitride barrier layer for semiconductor device applications

Method and apparatus for forming a barrier layer on a substrate

Method of forming a metal liner for interconnect structures

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

Ruthenium liner and cap for back-end-of-line applications

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process

Aluminum-nitride buffer and active layers by physical vapor deposition

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Methods and apparatus for improved metal ion filtering

Directional selective junction clean with field polymer protections

Processing system and method of forming a contact

Methods for depositing dielectric barrier layers and aluminum containing etch stop layers

Systems and methods for low resistivity physical vapor deposition of a tungsten film

Methods for depositing dielectric films via physical vapor deposition processes

Doping of metal barrier layers

Methods and devices using PVD ruthenium

Method and apparatus for depositing cobalt in a feature

Interconnect structures and methods of formation

Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor deposition

Impurity removal in doped ALD tantalum nitride

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

Cleaning of SIN with CCP plasma or RPS clean

Ruthenium liner and cap for back-end-of-line

Selective oxidation and simplified pre-clean

Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor deposition

Impurity removal in doped ALD tantalum nitride

Systems and methods for low resistivity physical vapor deposition of a tungsten film

Methods and apparatus for dynamically treating atomic layer deposition films in physical vapor deposition chambers

Methods and apparatus for processing a substrate

Oxidized barrier layer

Chlorine-free removal of molybdenum oxides from substrates

DING PEIJUN

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Self-ionized and inductively-coupled plasma for sputtering and resputtering

CAO YONG

Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming

GANGULI SESHADRI

Metal gate structures and methods for forming thereof

WANG RONGJUN

Substrate device having a tuned work function and methods of forming thereof

ZHU MINGWEI

PVD buffer layers for LED fabrication

HAWRYLCHAK LARA

Encapsulated sputtering target

GOPALRAJA PRABURAM

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

LEE JOUNG JOO

Methods for forming interconnect structures