Inventor
OH KYUNG SUK
US118 patents
⚠️ This page may combine multiple inventors who share the name “OH KYUNG SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAMBUS INC
28 patentsUS9117496B2Aug 25, 2015
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC28 citations98
US7486104B2Feb 3, 2009
Integrated circuit with graduated on-die termination
RAMBUS INC37 citations96
US10270442B2Apr 23, 2019
Memory component with on-die termination
RAMBUS INC7 citations93
US10056902B2Aug 21, 2018
On-die termination control
RAMBUS INC7 citations93
US9721629B2Aug 1, 2017
On-die termination of address and command signals
RAMBUS INC7 citations93
US9660648B2May 23, 2017
On-die termination control
RAMBUS INC6 citations93
US9337835B2May 10, 2016
Controlling a flash device having time-multiplexed, on-die-terminated signaling interface
RAMBUS INC8 citations93
US7162376B2Jan 9, 2007
Circuits, systems and methods for dynamic reference voltage calibration
RAMBUS INC33 citations93
US11211105B2Dec 28, 2021
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC3 citations84
US10770124B2Sep 8, 2020
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC3 citations84
US10192598B2Jan 29, 2019
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC4 citations84
US9734879B2Aug 15, 2017
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC5 citations84
US9455825B2Sep 27, 2016
Receiver with clock recovery circuit and adaptive sample and equalizer timing
RAMBUS INC5 citations84
US9166583B2Oct 20, 2015
Buffered memory module having multi-valued on-die termination
RAMBUS INC4 citations84
US7236894B2Jun 26, 2007
Circuits, systems and methods for dynamic reference voltage calibration
RAMBUS INC14 citations84
US7915912B2Mar 29, 2011
Signal lines with internal and external termination
RAMBUS INC8 citations82
US7602209B2Oct 13, 2009
Controlling memory devices that have on-die termination
RAMBUS INC5 citations82
US9225328B2Dec 29, 2015
Nonvolatile memory device with time-multiplexed, on-die-terminated signaling interface
RAMBUS INC2 citations74
US9135206B2Sep 15, 2015
Command-triggered on-die termination
RAMBUS INC3 citations74
US8947962B2Feb 3, 2015
On-die termination of address and command signals
RAMBUS INC2 citations74
US7924048B2Apr 12, 2011
Memory controller that controls termination in a memory device
RAMBUS INC3 citations74
US7782082B2Aug 24, 2010
Memory-module buffer with on-die termination
RAMBUS INC2 citations74
US12395173B2Aug 19, 2025
Integrated circuit that applies different data interface terminations during and after write data reception
RAMBUS INC0 citations73
US11783879B2Oct 10, 2023
Memory device comprising programmable command-and-address and/or data interfaces
RAMBUS INC1 citations73
US11349478B2May 31, 2022
Integrated circuit that applies different data interface terminations during and after write data reception
RAMBUS INC0 citations73
US11063791B2Jul 13, 2021
Receiver with clock recovery circuit and adaptive sample and equalizer timing
RAMBUS INC3 citations73
US10944400B2Mar 9, 2021
On-die termination control
RAMBUS INC0 citations73
US10536304B2Jan 14, 2020
Receiver with clock recovery circuit and adaptive sample and equalizer timing
RAMBUS INC2 citations73
SAMSUNG ELECTRONICS CO LTD
8 patentsUS11862618B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations84
US10861826B2Dec 8, 2020
Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations84
US10541201B2Jan 21, 2020
Semiconductor package, package-on-package device, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US10854551B2Dec 1, 2020
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations83
US11018173B2May 25, 2021
Image sensor
SAMSUNG ELECTRONICS CO LTD5 citations73
US10756015B2Aug 25, 2020
Semiconductor package, package-on-package device, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US11495576B2Nov 8, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11848308B2Dec 19, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
OH KYUNG SUK
7 patentsUS8451913B2May 28, 2013
Frequency responsive bus coding
OH KYUNG SUK77 citations98
US8588280B2Nov 19, 2013
Asymmetric communication on shared links
OH KYUNG SUK140 citations96
US8610459B2Dec 17, 2013
Controlling on-die termination in a dynamic random access memory device
OH KYUNG SUK9 citations92
US8610455B2Dec 17, 2013
Dynamic on-die termination selection
OH KYUNG SUK12 citations92
US8188762B2May 29, 2012
Controlling dynamic selection of on-die termination
OH KYUNG SUK11 citations92
US9913363B2Mar 6, 2018
Structure for delivering power
OH KYUNG SUK4 citations81
US8692574B2Apr 8, 2014
Methods and systems for reducing supply and termination noise
OH KYUNG SUK4 citations73
ALTERA CORP
5 patentsUS9935052B1Apr 3, 2018
Power line layout in integrated circuits
ALTERA CORP21 citations94
US9748934B1Aug 29, 2017
Systems and methods for reducing power supply noise or jitter
ALTERA CORP8 citations83
US8836384B1Sep 16, 2014
Systems and methods for reducing power supply noise or jitter
ALTERA CORP14 citations82
US9818471B1Nov 14, 2017
Circuitry and methods for measuring and correcting duty-cycle distortion
ALTERA CORP4 citations73
US9461631B1Oct 4, 2016
Circuitry and methods for measuring and correcting duty-cycle distortion
ALTERA CORP3 citations73
WILSON JOHN
1 patentLIN QI
1 patentShowing the top 50 of 118 patents by PatentIndex Score.