Inventor
IM YUN-HYEOK
KR27 patents
⚠️ This page may combine multiple inventors who share the name “IM YUN-HYEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
23 patentsUS8921990B2Dec 30, 2014
Semiconductor package
SAMSUNG ELECTRONICS CO LTD86 citations97
US6891259B2May 10, 2005
Semiconductor package having dam and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD80 citations97
US6835598B2Dec 28, 2004
Stacked semiconductor module and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD61 citations94
US6756668B2Jun 29, 2004
Semiconductor package having thermal interface material (TIM)
SAMSUNG ELECTRONICS CO LTD19 citations91
US9589945B2Mar 7, 2017
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD15 citations84
US7699520B2Apr 20, 2010
Micro heat flux sensor array
SAMSUNG ELECTRONICS CO LTD10 citations84
US7372148B2May 13, 2008
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US6781849B2Aug 24, 2004
Multi-chip package having improved heat spread characteristics and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD18 citations83
US11244936B2Feb 8, 2022
Semiconductor device package and apparatus comprising the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US9076881B2Jul 7, 2015
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10607971B2Mar 31, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US7388286B2Jun 17, 2008
Semiconductor package having enhanced heat dissipation and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US11782466B2Oct 10, 2023
Method of dynamic thermal management of electronic device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11171128B2Nov 9, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11119517B2Sep 14, 2021
Method of dynamic thermal management of electronic device
SAMSUNG ELECTRONICS CO LTD1 citations62
US10852080B2Dec 1, 2020
Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity
SAMSUNG ELECTRONICS CO LTD1 citations62
US9482584B2Nov 1, 2016
System and method for predicting the temperature of a device
SAMSUNG ELECTRONICS CO LTD2 citations62
US7375426B2May 20, 2008
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7081375B2Jul 25, 2006
Semiconductor package having thermal interface material (TIM)
SAMSUNG ELECTRONICS CO LTD4 citations61
US7601561B2Oct 13, 2009
Heat-radiating tape carrier package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US9666503B2May 30, 2017
Semiconductor package and electronic system including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9293389B2Mar 22, 2016
Method of manufacturing a semiconductor package including a surface profile modifier
SAMSUNG ELECTRONICS CO LTD0 citations51
US11658094B2May 23, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41
IM YUN-HYEOK
2 patentsUS8643179B2Feb 4, 2014
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
IM YUN-HYEOK11 citations82
US8587134B2Nov 19, 2013
Semiconductor packages
IM YUN-HYEOK8 citations82