Inventor
DORY THOMAS S
US21 patents
⚠️ This page may combine multiple inventors who share the name “DORY THOMAS S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS7183658B2Feb 27, 2007
Low cost microelectronic circuit package
INTEL CORP84 citations96
US6963483B2Nov 8, 2005
Self-aligned coaxial via capacitors
INTEL CORP66 citations95
US6565730B2May 20, 2003
Self-aligned coaxial via capacitors
INTEL CORP64 citations95
US6614122B1Sep 2, 2003
Controlling underfill flow locations on high density packages using physical trenches and dams
INTEL CORP86 citations94
US7371975B2May 13, 2008
Electronic packages and components thereof formed by substrate-imprinting
INTEL CORP28 citations92
US7847394B2Dec 7, 2010
Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
INTEL CORP10 citations84
US7316061B2Jan 8, 2008
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
INTEL CORP10 citations84
US7545030B2Jun 9, 2009
Article having metal impregnated within carbon nanotube array
INTEL CORP10 citations83
US7750441B2Jul 6, 2010
Conductive interconnects along the edge of a microelectronic device
INTEL CORP18 citations77
US7704791B2Apr 27, 2010
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
INTEL CORP7 citations74
US7964447B2Jun 21, 2011
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal
INTEL CORP3 citations62
US7594321B2Sep 29, 2009
Substrate-imprinting methods
INTEL CORP3 citations62
US7550841B2Jun 23, 2009
Methods of forming a diamond micro-channel structure and resulting devices
INTEL CORP3 citations62
US7637008B2Dec 29, 2009
Methods for manufacturing imprinted substrates
INTEL CORP4 citations61
US7294525B2Nov 13, 2007
High performance integrated inductor
INTEL CORP0 citations51
US7479687B2Jan 20, 2009
Deep via seed repair using electroless plating chemistry
INTEL CORP0 citations42
OLIN CORP
3 patentsUS4877641AOct 31, 1989
Process for plasma depositing silicon nitride and silicon dioxide films onto a substrate
OLIN CORP90 citations96
US4877651AOct 31, 1989
Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate
OLIN CORP46 citations92
US4561862ADec 31, 1985
Use of selected beta-nitroalkenes as cetane number boosters for diesel fuel
OLIN CORP5 citations62