Inventor
KIM DALSON YE SENG
SG7 patents
⚠️ This page may combine multiple inventors who share the name “KIM DALSON YE SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
6 patentsUS7205656B2Apr 17, 2007
Stacked device package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC58 citations94
US7049173B2May 23, 2006
Method for fabricating semiconductor component with chip on board leadframe
MICRON TECHNOLOGY INC15 citations91
US6903449B2Jun 7, 2005
Semiconductor component having chip on board leadframe
MICRON TECHNOLOGY INC20 citations91
US7846768B2Dec 7, 2010
Stacked die package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC5 citations72
US7425463B2Sep 16, 2008
Stacked die package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC7 citations72
US7459778B2Dec 2, 2008
Chip on board leadframe for semiconductor components having area array
MICRON TECHNOLOGY INC3 citations61