Inventor

HUANG CHENG-TANG

TW8 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHENG-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPMOS TECHNOLOGIES INC

4 patents

US7969003B2Jun 28, 2011

Bump structure having a reinforcement member

CHIPMOS TECHNOLOGIES INC11 citations81

US7888172B2Feb 15, 2011

Chip stacked structure and the forming method

CHIPMOS TECHNOLOGIES INC15 citations81

US7656020B2Feb 2, 2010

Packaging conductive structure for a semiconductor substrate having a metallic layer

CHIPMOS TECHNOLOGIES INC3 citations59

US7879651B2Feb 1, 2011

Packaging conductive structure and method for forming the same

CHIPMOS TECHNOLOGIES INC0 citations49

HUANG CHENG-TANG

1 patent

US8211789B2Jul 3, 2012

Manufacturing method of a bump structure having a reinforcement member

HUANG CHENG-TANG2 citations55

HUANG CHENG TANG

1 patent

US8274150B2Sep 25, 2012

Chip bump structure and method for forming the same

HUANG CHENG TANG0 citations45

CHI CHUNG-PANG

1 patent

US8319337B2Nov 27, 2012

Conductive structure for a semiconductor integrated circuit and method for forming the same

CHI CHUNG-PANG0 citations33

LIAO TSUNG-JEN

1 patent

US9196553B2Nov 24, 2015

Semiconductor package structure and manufacturing method thereof

LIAO TSUNG-JEN0 citations31