Inventor

RAMANATHAN LAKSHMI N

US8 patents

⚠️ This page may combine multiple inventors who share the name “RAMANATHAN LAKSHMI N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

4 patents

US6951801B2Oct 4, 2005

Metal reduction in wafer scribe area

FREESCALE SEMICONDUCTOR INC51 citations91

US7950144B2May 31, 2011

Method for controlling warpage in redistributed chip packaging panels

FREESCALE SEMICONDUCTOR INC7 citations81

US7723224B2May 25, 2010

Microelectronic assembly with back side metallization and method for forming the same

FREESCALE SEMICONDUCTOR INC7 citations70

US7812448B2Oct 12, 2010

Electronic device including a conductive stud over a bonding pad region

FREESCALE SEMICONDUCTOR INC5 citations61

VISWANATHAN LAKSHMINARAYAN

2 patents

US8803302B2Aug 12, 2014

System, method and apparatus for leadless surface mounted semiconductor package

VISWANATHAN LAKSHMINARAYAN9 citations83

US9263375B2Feb 16, 2016

System, method and apparatus for leadless surface mounted semiconductor package

VISWANATHAN LAKSHMINARAYAN0 citations51

RAMANATHAN LAKSHMI N

2 patents

US8236609B2Aug 7, 2012

Packaging an integrated circuit die with backside metallization

RAMANATHAN LAKSHMI N3 citations57

US8530346B2Sep 10, 2013

Process of forming an electronic device including a conductive stud over a bonding pad region

RAMANATHAN LAKSHMI N0 citations47