Inventor
CHIEN WEN-CHENG
TW29 patents
⚠️ This page may combine multiple inventors who share the name “CHIEN WEN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
14 patentsUS6297160B1Oct 2, 2001
Application of pure aluminum to prevent pad corrosion
TAIWAN SEMICONDUCTOR MFG29 citations92
US6001690ADec 14, 1999
Method of forming flash EPROM by using iso+aniso silicon nitride spacer etching technology
TAIWAN SEMICONDUCTOR MFG29 citations92
US6624465B1Sep 23, 2003
Multi-layer spacer technology for flash EEPROM
TAIWAN SEMICONDUCTOR MFG21 citations91
US6303510B1Oct 16, 2001
Plasma etch method with attenuated patterned layer charging
TAIWAN SEMICONDUCTOR MFG30 citations91
US6069042AMay 30, 2000
Multi-layer spacer technology for flash EEPROM
TAIWAN SEMICONDUCTOR MFG20 citations91
US6071826AJun 6, 2000
Method of manufacturing CMOS image sensor leakage free with double layer spacer
TAIWAN SEMICONDUCTOR MFG38 citations90
US6031264AFeb 29, 2000
Nitride spacer technology for flash EPROM
TAIWAN SEMICONDUCTOR MFG26 citations90
US5879993AMar 9, 1999
Nitride spacer technology for flash EPROM
TAIWAN SEMICONDUCTOR MFG35 citations90
US6319839B1Nov 20, 2001
Approach to form an inter-polysilicon oxide (IPO) layer for charge coupled devices
TAIWAN SEMICONDUCTOR MFG7 citations74
US6248661B1Jun 19, 2001
Method for monitoring bubble formation and abnormal via defects in a spin-on-glass planarization, etchback process
TAIWAN SEMICONDUCTOR MFG11 citations73
US6110843AAug 29, 2000
Etch back method for smoothing microbubble-generated defects in spin-on-glass interlayer dielectric
TAIWAN SEMICONDUCTOR MFG12 citations73
US6338668B1Jan 15, 2002
In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation
TAIWAN SEMICONDUCTOR MFG3 citations63
US6274397B1Aug 14, 2001
Method to preserve the testing chip for package's quality
TAIWAN SEMICONDUCTOR MFG5 citations62
US7029596B2Apr 18, 2006
Computer integrated manufacturing control system for oxide chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG3 citations57
TSAI CHIA-LUN
6 patentsUS8823179B2Sep 2, 2014
Electronic device package and method for fabricating the same
TSAI CHIA-LUN5 citations83
US8541877B2Sep 24, 2013
Electronic device package and method for fabricating the same
TSAI CHIA-LUN9 citations83
US8431950B2Apr 30, 2013
Light emitting device package structure and fabricating method thereof
TSAI CHIA-LUN5 citations71
US8384222B2Feb 26, 2013
Semiconductor device and manufacturing method thereof
TSAI CHIA-LUN3 citations62
US8319347B2Nov 27, 2012
Electronic device package and fabrication method thereof
TSAI CHIA-LUN3 citations62
US7968448B2Jun 28, 2011
Semiconductor device and manufacturing method thereof
TSAI CHIA-LUN1 citations51
CHIEN WEN-CHENG
4 patentsUS8367477B2Feb 5, 2013
Electronic device package and method for forming the same
CHIEN WEN-CHENG16 citations91
US8772919B2Jul 8, 2014
Image sensor package with trench insulator and fabrication method thereof
CHIEN WEN-CHENG5 citations79
US8232202B2Jul 31, 2012
Image sensor package and fabrication method thereof
CHIEN WEN-CHENG3 citations53
US8723214B2May 13, 2014
Submount and manufacturing method thereof
CHIEN WEN-CHENG0 citations40
XINTEC INC
3 patentsUS8552547B2Oct 8, 2013
Electronic device package and method for forming the same
XINTEC INC7 citations84
US9190362B2Nov 17, 2015
Image sensor package with trench insulator and fabrication method thereof
XINTEC INC2 citations59
US8643198B2Feb 4, 2014
Electronic device package and method for forming the same
XINTEC INC0 citations52