Inventor

LEE PO-HAN

TW27 patents

⚠️ This page may combine multiple inventors who share the name “LEE PO-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE PO-HAN

XINTEC INC

Chip package

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package and power module

Chip device packages and fabrication methods thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Manufacturing method of chip package

Chip package and method for forming the same

Chip package and method of manufacturing the same

Fabrication methods of chip device packages

Chip package and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Electrical contact structure with a redistribution layer connected to a stud

Chip package and method for forming the same

Semiconductor device structure and semiconductor package assembly

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Electrical contact structure with a redistribution layer connected to a stud

LIN CHIA-SHENG

Chip package and fabrication method thereof

Chip package and fabrication method thereof

TSAI CHIA-LUN

Electronic device package and method for fabricating the same

Electronic device package and fabrication method thereof

NAT CHUNG SHAN INST SCIENCE & TECH

Anode material of nano-silicon having multilayer-graphene as carrier and coated with silicon suboxide and with amorphous carbon layer and method for fabricating the same

DYNAPACK INTERNATIONAL TECH CORPORATION

Uninterruptible power system testing method