Inventor

MONTEZ RUBEN B

US21 patents

⚠️ This page may combine multiple inventors who share the name “MONTEZ RUBEN B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MONTEZ RUBEN B

FREESCALE SEMICONDUCTOR INC

Through substrate via with diffused conductive component

Reducing MEMS stiction by increasing surface roughness

Method of making a MEMS die having a MEMS device on a suspended structure

Method of producing microelectromechanical device with isolated microstructures

Rough MEMS surface

Reducing MEMS stiction by deposition of nanoclusters

Systems and methods for anchoring components in MEMS semiconductor devices

Glass frit wafer bond protective structure

Etch release residue removal using anhydrous solution

Bonded wafer structure having cavities with low pressure and method for forming

MONTEZ RUBEN B

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Glass frit wafer bond protective structure

Reducing MEMS stiction by introduction of a carbon barrier

Reducing MEMS stiction by introduction of a carbon barrier

NXP USA INC

Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer

Method for selective etching using dry film photoresist

STEIMLE ROBERT F

Reducing MEMS stiction by deposition of nanoclusters

Reducing MEMS stiction by deposition of nanoclusters

TURNER MICHAEL D

Reducing microelectromechanical systems stiction by formation of a silicon carbide layer

KARLIN LISA H

Method of making a micro-electro-mechanical-systems (MEMS) device