Inventor
BANG DONG HYUN
KR13 patents
⚠️ This page may combine multiple inventors who share the name “BANG DONG HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECH SINGAPORE HOLDING PTE LTD
7 patentsUS11004801B2May 11, 2021
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD4 citations69
US12187603B2Jan 7, 2025
Semiconductor package using a polymer substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11572269B2Feb 7, 2023
Semiconductor package using a polymer substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12009289B2Jun 11, 2024
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60
US12272655B2Apr 8, 2025
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
US11742300B2Aug 29, 2023
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
US11355451B2Jun 7, 2022
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
AMKOR TECHNOLOGY INC
6 patentsUS10032705B2Jul 24, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC9 citations82
US9809446B1Nov 7, 2017
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations72
US11152296B2Oct 19, 2021
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations60
US10822226B2Nov 3, 2020
Semiconductor package using a polymer substrate
AMKOR TECHNOLOGY INC0 citations51
US10144634B2Dec 4, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations51
US9056765B2Jun 16, 2015
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC1 citations50