Inventor

MALATKAR PRAMOD

US31 patents

⚠️ This page may combine multiple inventors who share the name “MALATKAR PRAMOD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MALATKAR PRAMOD

INTEL CORP

Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels

Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration

Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier

Bumpless build-up layer package with pre-stacked microelectronic devices

Bumpless build-up layer package warpage reduction

Retractable ledge socket

Methods of forming trenches in packages structures and structures formed thereby

Integrated circuit packages with patterned protective material

Constrained cure component attach process for improved IC package warpage control

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

Die back side structures for warpage control

Electronic package that includes lamination layer

Varied ball ball-grid-array (BGA) packages

Membrane test for mechanical testing of stretchable electronics

Printed heat spreader structures and methods of providing same

Mechanical failure monitoring, detection, and classification in electronic assemblies

Non-rectangular electronic device components

Bumpless build-up layer package design with an interposer

Bumpless build-up layer package with pre-stacked microelectronic devices

Thermal expansion compensators for controlling microelectronic package warpage

Thermal head with a thermal barrier for integrated circuit die processing

Reduced expansion thermal compression bonding process bond head

Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging

Method of assembling an electronic component using a probe having a fluid thereon

MALATKAR PRAMOD

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

Bumpless build-up layer package warpage reduction

Bumpless build-up layer package with pre-stacked microelectronic devices

Thermal expansion compensators for controlling microelectronic package warpage

Microelectronic package and stacked microelectronic assembly and computing system containing same

NALLA RAVI K

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby