Inventor
CARPENTER JR LOYDE MILTON
US6 patents
Patents
6 patentsUS9012267B2Apr 21, 2015
Method of manufacturing a packaged circuit including a lead frame and a laminate substrate
Intersil Americas LLC3 citations61
US9613889B2Apr 4, 2017
Packaged circuit with a lead frame and laminate substrate
Intersil Americas LLC0 citations50
US9627297B2Apr 18, 2017
Solder flow-impeding plug on a lead frame
Intersil Americas LLC0 citations49
US9536852B2Jan 3, 2017
Lead frame having a perimeter recess within periphery of component terminal
Intersil Americas LLC0 citations49
US9177896B2Nov 3, 2015
Solder flow-impeding plug on a lead frame
Intersil Americas LLC0 citations49
US9018746B2Apr 28, 2015
Solder flow impeding feature on a lead frame
Intersil Americas LLC0 citations49