Inventor
Lee Kuang-Chun
TW24 patents
Patents
24 patentsUS9653391B1May 16, 2017
Semiconductor packaging structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD23 citations94
US9870975B1Jan 16, 2018
Chip package with thermal dissipation structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US12327782B2Jun 10, 2025
Systems for semiconductor package mounting with improved co-planarity
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11764118B2Sep 19, 2023
Structure and formation method of chip package with protective lid
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10790164B1Sep 29, 2020
Method for forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10714463B2Jul 14, 2020
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10504880B2Dec 10, 2019
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276551B2Apr 30, 2019
Semiconductor device package and method of forming semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9748156B1Aug 29, 2017
Semiconductor package assembly, semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12512331B2Dec 30, 2025
Dummy through vias for integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12444706B2Oct 14, 2025
Package bonding structures and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368080B2Jul 22, 2025
Chip package structure with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300632B2May 13, 2025
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12283553B2Apr 22, 2025
Semiconductor die with warpage release layer structure in package and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12119276B2Oct 15, 2024
Package structure with protective lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978720B2May 7, 2024
Semiconductor device package and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855009B2Dec 26, 2023
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728233B2Aug 15, 2023
Chip package structure with ring structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11694974B2Jul 4, 2023
Semiconductor die with warpage release layer structure in package and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11508710B2Nov 22, 2022
Method of forming semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11410939B2Aug 9, 2022
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557646B2Feb 17, 2026
Multi-die package and methods of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10797006B2Oct 6, 2020
Structure and formation method of chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163816B2Dec 25, 2018
Structure and formation method of chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52