Inventor

HELLMUND OLIVER

DE23 patents

⚠️ This page may combine multiple inventors who share the name “HELLMUND OLIVER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HELLMUND OLIVER

INFINEON TECHNOLOGIES AG

Devices with backside metal structures and methods of formation thereof

Method of wafer thinning and realizing backside metal structures

Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layer

Bond pad structure

Molding compound and semiconductor package with a molding compound

Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements

Semiconductor device including an electrical contact with a metal layer arranged thereon

Isolation of semiconductor device with buried cavity

Devices with backside metal structures and methods of formation thereof

Method of manufacturing a hybrid device

Semiconductor device having semiconductor device elements in a semiconductor layer

Semiconductor device and manufacturing method

Method of manufacturing semiconductor devices with transistor cells and semiconductor device

Devices with backside metal structures and methods of formation thereof

Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support element

Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures

Semiconductor device and methods for forming a plurality of semiconductor devices

Substrates with buried isolation layers and methods of formation thereof

Methods for forming a semiconductor device and semiconductor devices

INFINEON TECHNOLOGIES AUSTRIA AG

Switch device

Switch device

Method of processing a porous conductive structure in connection to an electronic component on a substrate

HELLMUND OLIVER

Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements