Inventor
LU DARSEN D
US36 patents
⚠️ This page may combine multiple inventors who share the name “LU DARSEN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
33 patentsUS9455250B1Sep 27, 2016
Distributed decoupling capacitor
IBM12 citations93
US9786737B2Oct 10, 2017
FinFET with reduced parasitic capacitance
IBM10 citations84
US9583492B2Feb 28, 2017
Structure and method for advanced bulk fin isolation
IBM6 citations84
US9548386B1Jan 17, 2017
Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices
IBM11 citations84
US9299618B1Mar 29, 2016
Structure and method for advanced bulk fin isolation
IBM7 citations84
US10243042B2Mar 26, 2019
FinFET with reduced parasitic capacitance
IBM1 citations73
US10177223B2Jan 8, 2019
FinFET with reduced parasitic capacitance
IBM1 citations73
US9653541B2May 16, 2017
Structure and method to make strained FinFET with improved junction capacitance and low leakage
IBM4 citations73
US9583624B1Feb 28, 2017
Asymmetric finFET memory access transistor
IBM2 citations73
US9553173B1Jan 24, 2017
Asymmetric finFET memory access transistor
IBM5 citations73
US9543323B2Jan 10, 2017
Strain release in PFET regions
IBM3 citations73
US9515171B1Dec 6, 2016
Radiation tolerant device structure
IBM6 citations73
US9362400B1Jun 7, 2016
Semiconductor device including dielectrically isolated finFETs and buried stressor
IBM3 citations73
US11728428B2Aug 15, 2023
Dielectric isolated fin with improved fin profile
IBM0 citations63
US10903208B2Jan 26, 2021
Distributed decoupling capacitor
IBM0 citations63
US10892364B2Jan 12, 2021
Dielectric isolated fin with improved fin profile
IBM0 citations63
US10886385B2Jan 5, 2021
Semiconductor structures having increased channel strain using fin release in gate regions
IBM0 citations63
US10056474B2Aug 21, 2018
Semiconductor structures having increased channel strain using fin release in gate regions
IBM1 citations63
US9954083B2Apr 24, 2018
Semiconductor structures having increased channel strain using fin release in gate regions
IBM1 citations63
US9276113B2Mar 1, 2016
Structure and method to make strained FinFET with improved junction capacitance and low leakage
IBM2 citations63
US10734477B2Aug 4, 2020
FinFET with reduced parasitic capacitance
IBM0 citations52
US10593663B2Mar 17, 2020
Distributed decoupling capacitor
IBM0 citations52
US10546955B2Jan 28, 2020
Dielectric isolated fin with improved fin profile
IBM0 citations52
US10347752B2Jul 9, 2019
Semiconductor structures having increased channel strain using fin release in gate regions
IBM0 citations52
US10262991B2Apr 16, 2019
Distributed decoupling capacitor
IBM0 citations52
US9997540B2Jun 12, 2018
Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices
IBM0 citations52
US9966387B2May 8, 2018
Strain release in pFET regions
IBM0 citations52
US9917188B2Mar 13, 2018
Dielectric isolated fin with improved fin profile
IBM0 citations52
US9761610B2Sep 12, 2017
Strain release in PFET regions
IBM0 citations52
US9564439B2Feb 7, 2017
Structure and method for advanced bulk fin isolation
IBM0 citations52
US9548213B2Jan 17, 2017
Dielectric isolated fin with improved fin profile
IBM0 citations52
US9209065B1Dec 8, 2015
Engineered substrate and device for co-integration of strained silicon and relaxed silicon
IBM0 citations52
US10153157B2Dec 11, 2018
P-FET with graded silicon-germanium channel
IBM0 citations42
GLOBALFOUNDRIES INC
3 patentsUS9525027B2Dec 20, 2016
Lateral bipolar junction transistor having graded SiGe base
GLOBALFOUNDRIES INC13 citations84
US9825094B2Nov 21, 2017
FinFET PCM access transistor having gate-wrapped source and drain regions
GLOBALFOUNDRIES INC0 citations52
US9825093B2Nov 21, 2017
FinFET PCM access transistor having gate-wrapped source and drain regions
GLOBALFOUNDRIES INC0 citations52