P

Inventor

LU DARSEN D

US36 patents
⚠️ This page may combine multiple inventors who share the name “LU DARSEN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

33 patents
US9455250B1Sep 27, 2016

Distributed decoupling capacitor

IBM12 citations93
US9786737B2Oct 10, 2017

FinFET with reduced parasitic capacitance

IBM10 citations84
US9583492B2Feb 28, 2017

Structure and method for advanced bulk fin isolation

IBM6 citations84
US9548386B1Jan 17, 2017

Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices

IBM11 citations84
US9299618B1Mar 29, 2016

Structure and method for advanced bulk fin isolation

IBM7 citations84
US10243042B2Mar 26, 2019

FinFET with reduced parasitic capacitance

IBM1 citations73
US10177223B2Jan 8, 2019

FinFET with reduced parasitic capacitance

IBM1 citations73
US9653541B2May 16, 2017

Structure and method to make strained FinFET with improved junction capacitance and low leakage

IBM4 citations73
US9583624B1Feb 28, 2017

Asymmetric finFET memory access transistor

IBM2 citations73
US9553173B1Jan 24, 2017

Asymmetric finFET memory access transistor

IBM5 citations73
US9543323B2Jan 10, 2017

Strain release in PFET regions

IBM3 citations73
US9515171B1Dec 6, 2016

Radiation tolerant device structure

IBM6 citations73
US9362400B1Jun 7, 2016

Semiconductor device including dielectrically isolated finFETs and buried stressor

IBM3 citations73
US11728428B2Aug 15, 2023

Dielectric isolated fin with improved fin profile

IBM0 citations63
US10903208B2Jan 26, 2021

Distributed decoupling capacitor

IBM0 citations63
US10892364B2Jan 12, 2021

Dielectric isolated fin with improved fin profile

IBM0 citations63
US10886385B2Jan 5, 2021

Semiconductor structures having increased channel strain using fin release in gate regions

IBM0 citations63
US10056474B2Aug 21, 2018

Semiconductor structures having increased channel strain using fin release in gate regions

IBM1 citations63
US9954083B2Apr 24, 2018

Semiconductor structures having increased channel strain using fin release in gate regions

IBM1 citations63
US9276113B2Mar 1, 2016

Structure and method to make strained FinFET with improved junction capacitance and low leakage

IBM2 citations63
US10734477B2Aug 4, 2020

FinFET with reduced parasitic capacitance

IBM0 citations52
US10593663B2Mar 17, 2020

Distributed decoupling capacitor

IBM0 citations52
US10546955B2Jan 28, 2020

Dielectric isolated fin with improved fin profile

IBM0 citations52
US10347752B2Jul 9, 2019

Semiconductor structures having increased channel strain using fin release in gate regions

IBM0 citations52
US10262991B2Apr 16, 2019

Distributed decoupling capacitor

IBM0 citations52
US9997540B2Jun 12, 2018

Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices

IBM0 citations52
US9966387B2May 8, 2018

Strain release in pFET regions

IBM0 citations52
US9917188B2Mar 13, 2018

Dielectric isolated fin with improved fin profile

IBM0 citations52
US9761610B2Sep 12, 2017

Strain release in PFET regions

IBM0 citations52
US9564439B2Feb 7, 2017

Structure and method for advanced bulk fin isolation

IBM0 citations52
US9548213B2Jan 17, 2017

Dielectric isolated fin with improved fin profile

IBM0 citations52
US9209065B1Dec 8, 2015

Engineered substrate and device for co-integration of strained silicon and relaxed silicon

IBM0 citations52
US10153157B2Dec 11, 2018

P-FET with graded silicon-germanium channel

IBM0 citations42

GLOBALFOUNDRIES INC

3 patents