Inventor
GELORME JEFFREY DONALD
US31 patents
Patents
31 patentsUS6238599B1May 29, 2001
High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
IBM90 citations98
US5645764AJul 8, 1997
Electrically conductive pressure sensitive adhesives
IBM61 citations96
US6339116B1Jan 15, 2002
Methods of fabricating cross-linked biobased materials and structures fabricated therewith
IBM30 citations92
US6319650B1Nov 20, 2001
High resolution crosslinkable photoresist composition, compatable with high base concentration aqueous developers method and for use thereof
IBM26 citations92
US6010645AJan 4, 2000
Water-soluble electrically conducting polymers, their synthesis and use
IBM24 citations92
US5859655AJan 12, 1999
Photoresist for use in ink jet printers and other micro-machining applications
IBM23 citations92
US5833883ANov 10, 1998
Cross-linked biobased materials and uses thereof
IBM22 citations92
US5879859AMar 9, 1999
Strippable photoimageable compositions
IBM23 citations89
US6746770B1Jun 8, 2004
Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
IBM30 citations87
US7026643B2Apr 11, 2006
Organic n-channel semiconductor device of N,N' 3,4,9,10 perylene tetracarboxylic diimide
IBM15 citations82
US6103145AAug 15, 2000
Crosslinked water-soluble electrically conducting polymers
IBM12 citations81
US5759637AJun 2, 1998
Water-Soluable electrically conducting polymers, their synthesis and use
IBM12 citations81
US10586726B2Mar 10, 2020
Handler bonding and debonding for semiconductor dies
IBM1 citations73
US10325785B2Jun 18, 2019
Handler bonding and debonding for semiconductor dies
IBM2 citations73
US10224219B2Mar 5, 2019
Handler bonding and debonding for semiconductor dies
IBM2 citations73
US9947570B2Apr 17, 2018
Handler bonding and debonding for semiconductor dies
IBM3 citations73
US6830708B2Dec 14, 2004
Water-soluble electrically conducting polymers, their synthesis and use
IBM6 citations73
US5858943AJan 12, 1999
Gel for localized removal of reworkable encapsulant
IBM6 citations73
US10607963B2Mar 31, 2020
Chip package for two-phase cooling and assembly process thereof
IBM3 citations72
US5780199AJul 14, 1998
Polyamic acid and polyimide from fluorinated reactant
IBM8 citations72
US7037638B1May 2, 2006
High sensitivity crosslinkable photoresist composition, based on soluble, film forming dendrimeric calix[4] arene compositions method and for use thereof
IBM10 citations71
US7467742B1Dec 23, 2008
Electrically conducting adhesives for via fill applications
IBM2 citations63
US6017682AJan 25, 2000
Solid state extension method
IBM4 citations63
US11424152B2Aug 23, 2022
Handler bonding and debonding for semiconductor dies
IBM0 citations62
US11121005B2Sep 14, 2021
Handler bonding and debonding for semiconductor dies
IBM0 citations62
US7166241B1Jan 23, 2007
Water-soluble electrically conducting polymers, their synthesis and use
IBM5 citations62
US6013414AJan 11, 2000
Photosensitive polyimide-precursor formulation
IBM2 citations58
US6010832AJan 4, 2000
Photosensitive polyimide-precursor formulation
IBM2 citations58
US11094407B2Aug 17, 2021
Electronics miniaturization platform for medication verification and tracking
IBM0 citations52
US10679887B2Jun 9, 2020
Handler bonding and debonding for semiconductor dies
IBM0 citations52
US10573538B2Feb 25, 2020
Handler bonding and debonding for semiconductor dies
IBM0 citations52