Inventor
YANG Cornelia Tsang
US11 patents
Patents
11 patentsUS10586726B2Mar 10, 2020
Handler bonding and debonding for semiconductor dies
IBM1 citations73
US10325785B2Jun 18, 2019
Handler bonding and debonding for semiconductor dies
IBM2 citations73
US10224219B2Mar 5, 2019
Handler bonding and debonding for semiconductor dies
IBM2 citations73
US9947570B2Apr 17, 2018
Handler bonding and debonding for semiconductor dies
IBM3 citations73
US10702866B2Jul 7, 2020
Layered silicon and stacking of microfluidic chips
IBM2 citations72
US10032943B2Jul 24, 2018
Device layer thin-film transfer to thermally conductive substrate
IBM3 citations72
US10276439B2Apr 30, 2019
Rapid oxide etch for manufacturing through dielectric via structures
IBM2 citations69
US11529627B2Dec 20, 2022
Layered silicon and stacking of microfluidic chips
IBM0 citations62
US11121005B2Sep 14, 2021
Handler bonding and debonding for semiconductor dies
IBM0 citations62
US10679887B2Jun 9, 2020
Handler bonding and debonding for semiconductor dies
IBM0 citations52
US10573538B2Feb 25, 2020
Handler bonding and debonding for semiconductor dies
IBM0 citations52