Inventor

HSIEH BOR CHIUAN

TW22 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH BOR CHIUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH BOR CHIUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

System and method for supplying a precursor for an atomic layer deposition (ALD) process

System and method for supplying a precursor for an atomic layer deposition (ALD) process

FinFETs and methods of forming the same

Gap patterning for metal-to-source/drain plugs in a semiconductor device

Semiconductor device and method of forming the same

Seamless gap fill

Seamless gap fill

FinFETs and methods of forming the same

Gap patterning for metal-to-source/drain plugs in a semiconductor device

Gap patterning for metal-to-source/drain plugs in a semiconductor device

Dummy hybrid film for self-alignment contact formation

Seamless gap fill

Seamless gap fill

Hybrid film scheme for self-aligned contact

High performance self aligned contacts and method of forming same

TAIWAN SEMICONDUCTOR MFG

Method of forming a shallow trench isolation structure

Sidewall free CESL for enlarging ILD gap-fill window

Method of dual epi process for semiconductor device

Method of dual EPI process for semiconductor device

Sidewall-free CESL for enlarging ILD gap-fill window

CHUNG HAN-PIN

Method of dual EPI process for semiconductor device

HSIEH BOR CHIUAN

CMOS structure with multiple spacers