Inventor
LEE YUN TAE
KR46 patents
⚠️ This page may combine multiple inventors who share the name “LEE YUN TAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS7293183B2Nov 6, 2007
System for storing working context in a non-volatile memory while in a power-off suspend mode and restoring the working context when the power-off suspend mode is released
SAMSUNG ELECTRONICS CO LTD62 citations97
US7725746B2May 25, 2010
Apparatus and method for restoring working context
SAMSUNG ELECTRONICS CO LTD17 citations92
US7155556B2Dec 26, 2006
Devices and methods for converting remote device formats to host device formats for access to host associated resources
SAMSUNG ELECTRONICS CO LTD21 citations92
US6976108B2Dec 13, 2005
System on a chip having a system bus, an external bus, and a bus arbiter with programmable priorities for both buses, software, and method for assigning programmable priorities
SAMSUNG ELECTRONICS CO LTD26 citations92
US6654874B1Nov 25, 2003
Microcomputer systems having compressed instruction processing capability and methods of operating same
SAMSUNG ELECTRONICS CO LTD19 citations92
US7594126B2Sep 22, 2009
Processor system and method for reducing power consumption in idle mode
SAMSUNG ELECTRONICS CO LTD24 citations91
US8020081B2Sep 13, 2011
Multi-level cell memory devices using trellis coded modulation and methods of storing data in and reading data from the memory devices
SAMSUNG ELECTRONICS CO LTD12 citations84
US7873822B2Jan 18, 2011
System comprising electronic device and external device storing boot code for booting system
SAMSUNG ELECTRONICS CO LTD10 citations84
US10453821B2Oct 22, 2019
Connection system of semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations73
US7882344B2Feb 1, 2011
Memory system having a communication channel between a first processor and a second processor and memory management method that uses the communication channel
SAMSUNG ELECTRONICS CO LTD6 citations73
US10923464B2Feb 16, 2021
Connection system of semiconductor packages using a printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations63
US11791298B2Oct 17, 2023
Semiconductor package including plurality of semiconductor chips on common connection structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US11164838B2Nov 2, 2021
Semiconductor package including plurality of semiconductor chips on common connection structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US10930593B2Feb 23, 2021
Package on package and package connection system comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US7539825B2May 26, 2009
Multi-port memory device providing protection signal
SAMSUNG ELECTRONICS CO LTD4 citations62
US10734335B2Aug 4, 2020
Electronic component package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10535643B2Jan 14, 2020
Connection system of semiconductor packages using a printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations52
SAMSUNG ELECTRO MECH
16 patentsUS9824988B1Nov 21, 2017
Fan-out semiconductor package
SAMSUNG ELECTRO MECH18 citations93
US11488906B2Nov 1, 2022
Bridge embedded interposer, and package substrate and semiconductor package comprising the same
SAMSUNG ELECTRO MECH6 citations74
US10943878B2Mar 9, 2021
Semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10304791B2May 28, 2019
Electronic component package
SAMSUNG ELECTRO MECH2 citations73
US10026703B2Jul 17, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10020272B2Jul 10, 2018
Electronic component package
SAMSUNG ELECTRO MECH2 citations73
US12412822B2Sep 9, 2025
Semiconductor chip and semiconductor package including the same
SAMSUNG ELECTRO MECH0 citations63
US11417631B2Aug 16, 2022
Semiconductor package
SAMSUNG ELECTRO MECH1 citations63
US11081283B2Aug 3, 2021
Multi-layered ceramic electronic component and mounting board thereof
SAMSUNG ELECTRO MECH0 citations62
US11163211B2Nov 2, 2021
Camera module actuator
SAMSUNG ELECTRO MECH1 citations60
US12022186B2Jun 25, 2024
Camera for vehicle
SAMSUNG ELECTRO MECH0 citations59
US11190884B2Nov 30, 2021
Terminal with hearing aid setting, and method of setting hearing aid
SAMSUNG ELECTRO MECH0 citations59
US11076243B2Jul 27, 2021
Terminal with hearing aid setting, and setting method for hearing aid
SAMSUNG ELECTRO MECH0 citations59
US11858528B2Jan 2, 2024
Driving control system with driving assistance control and autonomous driving control
SAMSUNG ELECTRO MECH0 citations52
US10840228B2Nov 17, 2020
Semiconductor package
SAMSUNG ELECTRO MECH0 citations42
US10734324B2Aug 4, 2020
Fan-out semiconductor package including stacked chips
SAMSUNG ELECTRO MECH0 citations41
HONG SI-HOON
2 patentsLEE YUN TAE
2 patentsUS10257426B2Apr 9, 2019
Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
LEE YUN TAE4 citations69
US9257467B2Feb 9, 2016
Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
LEE YUN TAE2 citations59