Inventor
WANG MING-HAN
TW8 patents
Patents
8 patentsUS11901252B2Feb 13, 2024
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations71
US11410902B2Aug 9, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US11375124B2Jun 28, 2022
Optical measurement equipment and method for measuring warpage of a workpiece
ADVANCED SEMICONDUCTOR ENG4 citations71
US10522508B2Dec 31, 2019
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations70
US12300560B2May 13, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11869828B2Jan 9, 2024
Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansion
ADVANCED SEMICONDUCTOR ENG0 citations60
US11598625B2Mar 7, 2023
Apparatus and method for deformation measurement
ADVANCED SEMICONDUCTOR ENG0 citations60
US11152274B2Oct 19, 2021
Multi-moldings fan-out package and process
ADVANCED SEMICONDUCTOR ENG1 citations59