Inventor
HU IAN
TW21 patents
Patents
21 patentsUS10453802B2Oct 22, 2019
Semiconductor package structure, semiconductor device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG17 citations85
US10985085B2Apr 20, 2021
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US11901252B2Feb 13, 2024
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations71
US11410902B2Aug 9, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US11375124B2Jun 28, 2022
Optical measurement equipment and method for measuring warpage of a workpiece
ADVANCED SEMICONDUCTOR ENG4 citations71
US12111114B2Oct 8, 2024
Heat transfer element, method for forming the same and semiconductor structure comprising the same
ADVANCED SEMICONDUCTOR ENG5 citations70
US10522508B2Dec 31, 2019
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations70
US11282767B2Mar 22, 2022
Semiconductor package structure and electronic device
ADVANCED SEMICONDUCTOR ENG2 citations68
US12322672B2Jun 3, 2025
Semiconductor package structure and semiconductor manufacturing process
ADVANCED SEMICONDUCTOR ENG0 citations62
US11217502B2Jan 4, 2022
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11410934B2Aug 9, 2022
Substrate and semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US12300560B2May 13, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11482482B2Oct 25, 2022
Substrate structures, methods for forming the same and semiconductor device structures comprising the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11139222B2Oct 5, 2021
Electronic device comprising heat pipe contacting a cover structure for heat dissipation
ADVANCED SEMICONDUCTOR ENG0 citations60
US11081420B2Aug 3, 2021
Substrate structure and semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations60
US10861726B2Dec 8, 2020
Apparatus and method for measuring warpage
ADVANCED SEMICONDUCTOR ENG1 citations60
US11152274B2Oct 19, 2021
Multi-moldings fan-out package and process
ADVANCED SEMICONDUCTOR ENG1 citations59
US11024557B2Jun 1, 2021
Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die
ADVANCED SEMICONDUCTOR ENG0 citations59
US11139226B2Oct 5, 2021
Semiconductor package structure and assembly structure
ADVANCED SEMICONDUCTOR ENG0 citations58
US11075186B2Jul 27, 2021
Semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations47
US10410942B2Sep 10, 2019
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations47