Inventor
AMELIO WILLIAM J
US8 patents
Patents
8 patentsUS4448804AMay 15, 1984
Method for selective electroless plating of copper onto a non-conductive substrate surface
IBM80 citations94
US4525390AJun 25, 1985
Deposition of copper from electroless plating compositions
IBM27 citations92
US4639380AJan 27, 1987
Process for preparing a substrate for subsequent electroless deposition of a metal
IBM29 citations89
US4786528ANov 22, 1988
Process for treating reinforced polymer composite
IBM16 citations72
US4654126AMar 31, 1987
Process for determining the plating activity of an electroless plating bath
IBM14 citations72
US4593016AJun 3, 1986
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
IBM11 citations72
US4655833AApr 7, 1987
Electroless copper plating bath and improved stability
IBM9 citations68
US4820643AApr 11, 1989
Process for determining the activity of a palladium-tin catalyst
IBM3 citations58