Inventor
MARKOVICH VOYA
US29 patents
⚠️ This page may combine multiple inventors who share the name “MARKOVICH VOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS6929900B2Aug 16, 2005
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM127 citations98
US6686539B2Feb 3, 2004
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM109 citations97
US4448804AMay 15, 1984
Method for selective electroless plating of copper onto a non-conductive substrate surface
IBM80 citations94
US4478883AOct 23, 1984
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
IBM57 citations93
US5055342AOct 8, 1991
Fluorinated polymeric composition, fabrication thereof and use thereof
IBM69 citations92
US4525390AJun 25, 1985
Deposition of copper from electroless plating compositions
IBM27 citations92
US4554182ANov 19, 1985
Method for conditioning a surface of a dielectric substrate for electroless plating
IBM50 citations91
US4718972AJan 12, 1988
Method of removing seed particles from circuit board substrate surface
IBM21 citations78
US4534797AAug 13, 1985
Method for providing an electroless copper plating bath in the take mode
IBM7 citations73
US4786528ANov 22, 1988
Process for treating reinforced polymer composite
IBM16 citations72
US4654126AMar 31, 1987
Process for determining the plating activity of an electroless plating bath
IBM14 citations72
US4593016AJun 3, 1986
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
IBM11 citations72
US4655833AApr 7, 1987
Electroless copper plating bath and improved stability
IBM9 citations68
US7083901B2Aug 1, 2006
Joining member for Z-interconnect in electronic devices without conductive paste
IBM4 citations63
US4820643AApr 11, 1989
Process for determining the activity of a palladium-tin catalyst
IBM3 citations58
ENDICOTT INTERCONNECT TECH INC
10 patentsUS7508076B2Mar 24, 2009
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
ENDICOTT INTERCONNECT TECH INC56 citations96
US7142121B2Nov 28, 2006
Radio frequency device for tracking goods
ENDICOTT INTERCONNECT TECH INC83 citations92
US6992896B2Jan 31, 2006
Stacked chip electronic package having laminate carrier and method of making same
ENDICOTT INTERCONNECT TECH INC17 citations92
US7209368B2Apr 24, 2007
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
ENDICOTT INTERCONNECT TECH INC20 citations91
US7078816B2Jul 18, 2006
Circuitized substrate
ENDICOTT INTERCONNECT TECH INC23 citations91
US7665207B2Feb 23, 2010
Method of making a multi-chip electronic package having laminate carrier
ENDICOTT INTERCONNECT TECH INC16 citations83
US7161810B2Jan 9, 2007
Stacked chip electronic package having laminate carrier and method of making same
ENDICOTT INTERCONNECT TECH INC11 citations83
US7478472B2Jan 20, 2009
Method of making circuitized substrate with signal wire shielding
ENDICOTT INTERCONNECT TECH INC7 citations72
US7416996B2Aug 26, 2008
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC7 citations72
US7552091B2Jun 23, 2009
Method and system for tracking goods
ENDICOTT INTERCONNECT TECH INC1 citations48