Inventor
BRADEN JEFFREY S
US17 patents
⚠️ This page may combine multiple inventors who share the name “BRADEN JEFFREY S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OLIN CORP
13 patentsUS5608267AMar 4, 1997
Molded plastic semiconductor package including heat spreader
OLIN CORP339 citations99
US5629835AMay 13, 1997
Metal ball grid array package with improved thermal conductivity
OLIN CORP138 citations98
US5367196ANov 22, 1994
Molded plastic semiconductor package including an aluminum alloy heat spreader
OLIN CORP131 citations97
US5504372AApr 2, 1996
Adhesively sealed metal electronic package incorporating a multi-chip module
OLIN CORP44 citations96
US5399805AMar 21, 1995
Metal electronic package with reduced seal width
OLIN CORP66 citations96
US5324888AJun 28, 1994
Metal electronic package with reduced seal width
OLIN CORP45 citations96
US5073521ADec 17, 1991
Method for housing a tape-bonded electronic device and the package employed
OLIN CORP76 citations96
US5025114AJun 18, 1991
Multi-layer lead frames for integrated circuit packages
OLIN CORP76 citations96
US5043534AAug 27, 1991
Metal electronic package having improved resistance to electromagnetic interference
OLIN CORP76 citations95
US5013871AMay 7, 1991
Kit for the assembly of a metal electronic package
OLIN CORP50 citations92
US5132773AJul 21, 1992
Carrier ring having first and second ring means with bonded surfaces
OLIN CORP20 citations80
US5234536AAug 10, 1993
Process for the manufacture of an interconnect circuit
OLIN CORP14 citations74
US4970781ANov 20, 1990
Process plate for plastic pin grid array manufacturing
OLIN CORP18 citations72