Inventor

HERNANDEZ JORGE M

US30 patents

⚠️ This page may combine multiple inventors who share the name “HERNANDEZ JORGE M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERNANDEZ JORGE M

ROGERS CORP

Internally decoupled integrated circuit package

Molded integrated circuit package incorporating heat sink

Multilayer printed wiring board

Molded integrated circuit package incorporating decoupling capacitor

Decoupling capacitor for pin grid array package

Molded integrated circuit package incorporating thin decoupling capacitor

High dielectric constant flexible sheet material

Low inductance decoupling capacitor

High dielectric multilayer capacitor

Decoupling capacitor for leadless surface mounted chip carrier

Decoupling capacitor and method of manufacture thereof

Decoupling capacitor for Pin Grid Array package

Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages

Multilayer capacitor elements

Decoupling capacitor and method of formation thereof

Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package

Thin decoupling capacitor for mounting under integrated circuit package

Decoupling capacitor for surface mounted chip carrier

High capacitance bus bar including multilayer ceramic capacitors

Low impedance bus bar

Decoupling capacitor and method of formation thereof

Decoupling capacitor and method of manufacture thereof

Temperature stable multilayer capacitor

CIRCUIT COMPONENTS INC

Device for interconnecting integrated circuit packages to circuit boards

Multilayer printed wiring board

Method of making microwave circuit package

Multiple resonant frequency decoupling capacitor

HERNANDEZ JORGE M

Integrated circuit package having an internal cavity for incorporating decoupling capacitor

MICROSUBSTRATES CORP

Microwave circuit packages having a reduced number of vias in the substrate

MICRO SUBSTRATES CORP

Method for filling vias in ceramic substrates with composite metallic paste